Packing alignment device for organic optoelectronic device and packing method thereof

A technology for optoelectronic devices and alignment devices, which is applied in the fields of electro-solid devices, photovoltaic power generation, electrical components, etc., can solve the problems of insufficient positioning accuracy of the substrate, and achieve easy control of the operation process, high precision, packaging method, and convenient operation. Effect

Inactive Publication Date: 2010-10-13
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The problem to be solved by the present invention is: how to provide a packaging alignment device for organic optoelectronic devices and a packaging method thereof. The production process is simpler and easier to operate, which improves packaging efficiency and reduces equipment requirements and production costs. Packaging for substrates of various sizes can meet production and scientific research requirements

Method used

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  • Packing alignment device for organic optoelectronic device and packing method thereof
  • Packing alignment device for organic optoelectronic device and packing method thereof
  • Packing alignment device for organic optoelectronic device and packing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Such as Figure 4 The basic structure of the organic electroluminescent device (OLED) packaging system shown is that the device substrate is a glass substrate of 50mm×50mm, and the packaging cover plate is etched with soda-lime glass. The whole device structure is described as: glass substrate / ITO / NPB(50nm) / Alq3(30nm) / Mg:Ag(100nm).

[0042] The preparation method is as follows:

[0043] ①. Use acetone solution, deionized water and ethanol solution to ultrasonically clean the conductive substrate ITO glass, and dry it with dry nitrogen after cleaning. The ITO film on the glass substrate is used as the anode layer of the device, the square resistance of the ITO film is 12Ω / sq, and the film thickness is 180nm;

[0044] ②. Move the dried substrate into a vacuum chamber, and pretreat the ITO glass with low-energy oxygen plasma for 10 minutes under an oxygen pressure environment with an air pressure of 20Pa, and the sputtering power is 0-20W;

[0045] ③. Place the processe...

Embodiment 2

[0054] Such as Figure 4 The basic structure of the organic electroluminescent device (OLED) packaging system shown is that the device substrate is a glass substrate of 50mm×50mm, and the packaging cover plate is etched with soda-lime glass. The entire device structure is described as: glass substrate / ITO / CuPc(20nm) / α-NPD(60nm) / Alq 3 (40nm):C545T(2%) / Alq 3 (20nm) / Mg:Ag(100nm).

[0055] The preparation method is as follows:

[0056] ①. Use acetone solution, deionized water and ethanol solution to ultrasonically clean the conductive substrate ITO glass, and dry it with dry nitrogen after cleaning. The ITO film on the glass substrate is used as the anode layer of the device, the square resistance of the ITO film is 12Ω / sq, and the film thickness is 180nm;

[0057] ②. Move the dried substrate into a vacuum chamber, and pretreat the ITO glass with low-energy oxygen plasma for 10 minutes under an oxygen pressure environment with an air pressure of 20Pa, and the sputtering power ...

Embodiment 3

[0067] Such as Figure 4 The basic structure of the organic electroluminescent device (OLED) packaging system shown is that the device substrate is a glass substrate of 50mm×50mm, and the packaging cover plate is etched with soda-lime glass. The entire device structure is described as: glass substrate / ITO / PVK:PFC(100nm) / BCP(10nm) / Alq 3 (15nm) / Mg:Ag(100nm).

[0068] The preparation method is as follows:

[0069] ①. Use acetone solution, deionized water and ethanol solution to ultrasonically clean the conductive substrate ITO glass, and dry it with dry nitrogen after cleaning. The ITO film on the glass substrate is used as the anode layer of the device, the square resistance of the ITO film is 12Ω / sq, and the film thickness is 180nm;

[0070] ②. Move the dried substrate into a vacuum chamber, and pretreat the ITO glass with low-energy oxygen plasma for 10 minutes under an oxygen pressure environment with an air pressure of 20Pa, and the sputtering power is 0-20W;

[0071] ③....

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Abstract

The invention discloses a packing alignment device for an organic optoelectronic device. The packing alignment device is characterized by comprising a cover plate, a positioning plate and a compaction plate; one side on the cover plate, contacted with a substrate, is provided with a cover plate groove corresponding to the substrate and over two positioning columns; the positioning plate is provided with a positioning hole and limit holes cooperated with the positioning columns, the size of the positioning hole is consistent with that of the substrate, and the positioning plate is nested on the positioning columns through the limit holes; one side of the substrate, provided with a functional layer of the organic optoelectronic device and facing the cover plate, is guided into the positioning hole; the compaction plate is provided with blocking holes cooperated with the positioning columns, and the compaction plate is nested on the positioning columns through the blocking holes so that the cover plate, the positioning plate and the compaction plate are precisely aligned; and meanwhile, the substrate and the cover plate are compacted. The packing alignment device solves the problem of insufficient substrate positioning precision caused by alignment defect during packing the device so that the production process is simpler and easier for operation, and improves the packing efficiency.

Description

technical field [0001] The invention relates to the technical field of organic electroluminescence in electronic components, in particular to a packaging alignment device for organic optoelectronic devices and a packaging method based on the device. Background technique [0002] Optoelectronics technology is a high-tech industry that develops rapidly after microelectronics technology. With the rapid development of optoelectronic technology, optoelectronic products such as solar cells, optical image sensors, plasma flat panel displays, electroluminescent displays, thin film transistors, and liquid crystal display panels have gradually matured, and they have greatly improved human life. At the same time, the wide application of optoelectronic information technology in various fields of social life has also created a huge growing market. Developed countries regard the optoelectronic information industry as one of the key development areas, and the competition in the optoelectr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/00H01L51/56H01L51/40H01L51/48
CPCY02E10/549Y02P70/50
Inventor 于军胜余双江马柱蒋亚东
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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