Radiation-sensitive resin composition, interlayer insulating film and method for forming the same

Abstract

The present invention relates to a radiation-sensitive resin composition, an interlayer insulating film and method for forming the same. The present invention provides the interlayer insulating film which is suitable for being used for a flexible display. Furthermore the radiation-sensitive resin composition can be heated at a low temperature in a short time for burning and simultaneously has high radiation sensitivity. The radiation-sensitive resin composition for forming interlayer insulating film according to the invention comprises the following components: [A] copolymer base soluble resin which is formed by the polymerization of monomer comprising (a1) unsaturated carboxylic acid and / or unsaturated carboxylic anhydride and (a2) unsaturated compound with epoxy group; [B] 1,2-quinonediazide compound and [C] a compound with more than two hydrosulfuryls in one module; wherein the component [C] with more than two hydrosulfuryls in more module is preferably a compound represented by the formula (1).

Description

technical field The present invention relates to a radiation-sensitive resin composition suitable for forming an interlayer insulating film of a flexible display, an interlayer insulating film formed from the composition, and a method for forming the same. Background technique In recent years, due to improvements in convenience such as weight reduction and miniaturization, flexible displays such as liquid crystal electronic papers have become popular. As substrates for such flexible displays, plastic substrates such as polycarbonate and polyethylene terephthalate have been studied instead of glass substrates. However, these plastics have a problem of being slightly stretched and shrunk when heated, which affects the functions of the display, so improvement of heat resistance is urgently required. On the other hand, in order to reduce the thermal stress applied to the plastic substrate, it is also studied to lower the temperature of the manufacturing process of the flexible ...

AI Technical Summary

Problems solved by technology

However, the coating liquid containing the polyimide precursor of the above-mentioned document is a chemical curing system, and has no pattern forming ability of exposure and development, so fine patterns cannot be formed.

In addition, when an insulating film is formed using a coating solution containing such a polyimide precursor, there is a problem that it takes more than 1 hour to heat and bake the cured film.

Images