Method for manufacturing printed circuit board and printed circuit board
A technology of printed circuit board and manufacturing method, which is applied in the direction of multi-layer circuit manufacturing, printed circuit components, and the formation of electrical connection of printed components, etc.
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[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0031] figure 1 A schematic structural diagram of a sub-board used in an embodiment of the present invention, such as figure 1 As shown, the metallized hole 12 is provided on the sub-board 11, and the hole wall 121 and the hole plate 122 of the metallized hole 12 are made of conductive materials to conduct electrical signals. The conductive material can specifically be a metal material with good electrical conductivity. The hole wall 121 is located in the h...
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