Supercharge Your Innovation With Domain-Expert AI Agents!

An n-p Complementary Schottky Diode Structure

A Schottky diode and Schottky junction technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems affecting the performance of Schottky diodes, affecting forward and reverse characteristics, and affecting overall performance, etc. Achieve excellent forward and reverse characteristics, improve overall performance, good chemical stability and temperature stability

Active Publication Date: 2012-02-08
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this technical solution is only effective for improving the performance of N-type Schottky diodes. For P-type Schottky diodes, the introduction of metal silicide will affect its forward and reverse characteristics, resulting in high power consumption. Affects the performance of Schottky diodes
[0005] In the existing semiconductor technology, due to the limitation of the processing technology, the N-type Schottky diode and the P-type Schottky diode on the same semiconductor substrate usually contain a metal silicide layer, or neither contain a metal silicide layer , which seriously affects the overall performance of N-P complementary Schottky diodes

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An n-p Complementary Schottky Diode Structure
  • An n-p Complementary Schottky Diode Structure
  • An n-p Complementary Schottky Diode Structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0024] Firstly, a first specific implementation manner of the N-P complementary Schottky diode structure according to the present invention is given with reference to the accompanying drawings.

[0025] Figure 2a It is a schematic structural diagram of the N-P complementary Schottky diode described in this specific embodiment.

[0026] Such as Figure 2a As shown, the N-P complementary Schottky diode structure 200a provided by the present invention includes an N-type Schottky diode 210a and a P-type Schottky diode 220a, wherein: the N-type Schottky diode 210a and the P-type Schottky diode 220a is located on the same semiconductor substrate 201; N-type Schottky diode 210a includes N-type lightly doped well region 202, metal silicide 203, diffusion barrier layer ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An N-P complementary Schottky diode structure, including an N-type Schottky diode and a P-type Schottky diode on the same semiconductor substrate, wherein the N-type Schottky diode structure includes a lightly doped well region directly The contact metal silicide, while the P-type Schottky diode does not include a metal silicide layer. The N-P complementary Schottky diode structure provided by the present invention is compared with the N-P complementary Schottky diodes that both traditional N and P Schottky diodes include a metal silicide layer or do not include a metal silicide layer, and overcome the oxidation of metal materials. The impact on the characteristics of the N-type Schottky junction, while overcoming the influence of metal silicide on the characteristics of the P-type Schottky junction, to achieve low power consumption technical indicators, so that both N and P Schottky diodes have excellent positive Direct and reverse characteristics, improve the performance of N-P complementary Schottky diodes.

Description

technical field [0001] The invention relates to a semiconductor diode device, in particular to an N-P complementary Schottky diode structure, belonging to the technical field of semiconductors. Background technique [0002] The Schottky diode is a two-terminal semiconductor device developed based on the metal-semiconductor contact theory of semiconductor physics. Schottky diodes have low forward voltage drop, short reverse recovery time, fast switching speed, small noise figure, small series resistance, good high-frequency characteristics and switching characteristics. Using the nonlinear resistance of Schottky diodes, they can also be used as Used in microwave mixers; as varactor diodes, it can be used in parametric amplifiers; in ultra-high-speed logic circuits, it can be used as fast clamping diodes; Schottky diodes are widely used in various high-frequency, microwave and high-speed circuits, Schott Base diodes are also particularly suitable for switching power supplies....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/08H01L29/872
Inventor 黎坡
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More