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Assembling device and method for display panel and a treatment device thereof and a baseplate delivery mechanism

A display panel and assembly device technology, which is applied in the direction of conveyor objects, furnace components, transportation and packaging, etc., can solve the problems of long length of display panel module assembly device and increased number of processing operation devices, etc.

Inactive Publication Date: 2013-11-06
HITACHI HIGH-TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, there is a problem that the number of connected processing devices increases, and the overall length of the display panel module assembly device becomes very long.

Method used

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  • Assembling device and method for display panel and a treatment device thereof and a baseplate delivery mechanism
  • Assembling device and method for display panel and a treatment device thereof and a baseplate delivery mechanism
  • Assembling device and method for display panel and a treatment device thereof and a baseplate delivery mechanism

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Embodiment Construction

[0119] Below, use Figure 1 to Figure 5 One embodiment of the present invention will be described.

[0120] figure 1 It is a figure which shows one Example for demonstrating the basic structure of the display panel board|substrate conveyance apparatus of this invention, and the display panel module assembly apparatus using the same.

[0121] figure 1 The device in FIG. 1 is a device that sequentially transports the substrate 10 from left to right in the figure, and performs various processing operations on the peripheral portion of the substrate, and performs mounting and assembling operations such as ICs and TABs. exist figure 1 In the device, firstly, after processing the long side (source side) of the substrate using the processing unit 1 on the long side (source side) of the substrate, the substrate is rotated by the rotary table 2, and secondly, the short side of the substrate is used to The processing operation device group 3 (gate side) performs processing operation...

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PUM

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Abstract

This invention provides an assemblying device for display panel, where different dealing devices can be connected with each other with a necessary minimal width, therefore, reducing the whole length of the display module assemblying device, furthermore, providing varied substrates with different sizes ranged from small size to great size so as to forming a high precision and high speed dealing process. By mean of arranging multiple slight substrate holding components and substrate transmitting components side-by-side along certain direction especially in the substrate transmitting direction, an integrated substrate holding component and substrate transmitting mechanism achieves the object to transmit varied substrates with different sizes ranged from small size to great size. In addition, the display panel substrate that transmits different dealing devices all together and with same time order, can connect different dealing devices with a necessary width, furthermore, by means of moving the substrate transmitting mechanism after transmitting motion to the transmitting upstream during substrate dealing operation, high precision and high speed substrate transmitting and dealing motion can be achieved.

Description

technical field [0001] The present invention relates to mounting a drive IC or COF (Chip on Film flexible board), FPC (Flexible Printed Circuits) around a display panel (display unit substrate) of an FPD (=Flat Panel Display) such as liquid crystal or plasma. circuit) and other so-called TAB (=Tape Automated Bonding) connection, and a display panel module assembly device for mounting peripheral substrates (PCB=printed circuit board printed circuit board). More specifically, it is possible to more efficiently arrange each processing step in the display panel module assembling device or to more stably transfer and transport the display panel substrate conveying device of the display panel. Background technique [0002] The display panel module assembly device performs multiple processing steps sequentially on the display panel substrate of the FPD such as plasma (or simply referred to as the substrate, and in the case of other substrates such as PCB, it is written as the PCB s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J9/00H01J9/48H01J9/42B65G49/06B65G47/24
Inventor 宫坂彻片保秀明山崎不二夫斧城淳渡边丰
Owner HITACHI HIGH-TECH CORP
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