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Low-temperature solidification electric-conduction slurry

A technology of conductive paste and low temperature, which is applied in the direction of conductive materials, conductive materials, conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as inability to meet the use requirements, and achieve the effect of reducing costs

Inactive Publication Date: 2010-04-28
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it is impossible to meet the needs of customers who have strict requirements on the resistance of conductive silver paste

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Select flake silver powder with a particle size of 6-7 μm and a tap density of 1.6-2.0 g / ml and a spherical silver powder with a particle size of 5-8 μm and a tap density of 1.0-2.5 g / ml to mix. The ratio (mass percentage ) is 70:30.

[0031] The solvent is DBE.

[0032] The polymer resin is selected as Dow Chemical VAGH type vinyl chloride resin.

[0033] The mass percent content of each component is:

[0034] Conductive silver powder: 50%,

[0035] Solvent: 40%,

[0036] Polymer resin: 9%,

[0037] Coupling agent 1%

[0038] First, the solvent and the polymer resin are mixed at a high speed at 70°C to form a uniform organic carrier, and the mass ratio of the solvent to the polymer resin is 40:9; then the conductive silver powder is pre-mixed, and then the mixed powder is added to the In the organic vehicle, Dow Corning's organosilane coupling agent A-1020 was added, and the final conductive paste was obtained after being stirred by a mixer and ground by a three-...

Embodiment 2

[0040] Select flake silver powder with a particle size of 7-9 μm and a tap density of 1.2-1.6 g / ml and a spherical silver powder with a particle size of 2-5 μm and a tap density of 3.0-4.0 g / ml to mix, and the ratio is 80: 20.

[0041] The solvent is ethyl carbitol acetate and butyl cellosolve acetate mixed in a ratio of 3:2.

[0042] The polymer resin is selected as Dow Chemical VAGH type vinyl acetate resin and Toyobo 270 type polyester resin mixed in a ratio of 4:1.

[0043] The content of each component is:

[0044] Conductive silver powder: 45%,

[0045] Solvent: 40%,

[0046] Polymer resin: 12.5%,

[0047] Coupling agent 1.5%,

[0048] Leveling agent 1.0%,

[0049] First, the solvent and the polymer resin are mixed at a high speed at 70°C to form a uniform organic carrier, and the mass ratio of the solvent to the polymer resin is 40:12.5; then the conductive silver powder is pre-mixed, and then the mixed powder is added to the In the organic carrier, Dow Corning's...

Embodiment 3

[0051] Select flake silver powder with a particle size of 9-10 μm and a tap density of 0.9-1.2 g / ml and a spherical silver powder with a particle size of 0.1-2.0 μm and a tap density of 2.5-3.0 g / ml to mix, and the ratio is 75 : 25.

[0052] The solvent is ethyl carbitol acetate.

[0053] The polymer resin is selected as Toyobo 270 type and 650 type polyester resin and mixed according to the ratio of 7:3.

[0054] The content of each component is:

[0055] Conductive silver powder: 48%,

[0056] Solvent: 42%,

[0057] Polymer resin: 9%,

[0058] Leveling agent 1.0%,

[0059] First, the solvent and the polymer resin are mixed at a high speed at 70°C to form a homogeneous organic carrier, and the mass ratio of the solvent to the polymer resin is 42:9; then the conductive silver powder is pre-mixed, and then the mixed powder is added to the In the organic carrier, add leveling agent BYK additives, after stirring with a mixer and grinding with a three-roller machine, the fin...

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Abstract

The invention provides a low-temperature solidification electric-conduction slurry with less than 50 percent of silver content; the electric-conduction slurry comprises the following raw materials by mass percent: 45-50 percent of electric-conduction silver powder, 40-45 percent of solvent, 7-15 percent of macromolecule resin and 0-5 percent of additives; the electric-conduction silver powder is silver strip powder and silver ball powder, the solvent is more than one or two kinds of DBE, diethylene glycol monoethyl ether acetate and butyl cellosolve acetate, the macromolecule resin adopts one or two kinds of chloride-vinyl acetate resin and polyester resin, and the additives are one or two kinds coupling agents or flatting agents; in the invention, the strict using requirements of customers on resistance can be met while reducing the cost; in addition, the low-temperature solidification electric-conduction slurry has less than 50 percent of silver content, and the square resistance can reach 13megohm / square.

Description

Technical field: [0001] The invention relates to a low-temperature curing conductive paste, which can be used in the fields of keyboard circuit printing, membrane switch and the like. Background technique: [0002] At present, the low-temperature curing silver paste technology has become increasingly mature. In today's more intense and cruel industry competition, cost reduction has become the focus of both low-temperature curing silver paste manufacturers and users. Nowadays, foreign silver paste manufacturers such as Acheson, Dupont, Fujikura, and Changxing have launched low-silver-content low-temperature curing conductive silver pastes. The mainstream low-temperature-curable silver pastes on the market have a silver content of about 51-55%. At present, some domestic manufacturers are trying to launch conductive silver paste with 50% silver content to further reduce the cost. Due to its low silver content, its square resistance value is relatively high, and the general squ...

Claims

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Application Information

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IPC IPC(8): H01B1/00H01B1/02H01B1/22
Inventor 朱万超
Owner IRICO
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