Gripper, in particular a bernoulli gripper

Abstract

The invention relates to a gripper (1), in particular a Bernoulli gripper for holding two-dimensional components such as silicon-based wafers (2) with a low degree of loading, having a clamping ring (4) connected to a controllable robot arm (3), having a baffle plate (6) which is connected to the clamping ring (4) by means of a funnel-shaped component (5) and has a gripping face (7) which communicates with a flow system (8) which passes through the funnel-shaped component (5) and the baffle plate (6) and by means of which, after an excess pressure has been applied to the Bernoulli gripper (1),a negative pressure is to be produced on the gripping face (7) of the baffle plate (6) in order to attach by suction the wafer (2) to be gripped, having a rubberized bearing surface (9) of a bearingring (10) which is integrated in the gripping face (7) and provides a slip-resistant movement of the wafer (2) attached to the gripping face (7) by suction, and having a sensor (11) for detecting thewafer (2) attached to the gripping face (7) by suction. In order to permit an extremely shock-resistant attachment of the wafer to be gripped on the gripping face of the gripper, the invention provides a damping device (12) which is circumferentially adapted to the gripper (1), the contour of which device, as viewed in the plan view of the gripper (1), protrudes circumferentially above the contourof the latter, and which device forms such a damping resistance for the wafer (2) to be gripped during its suction-induced approach towards the gripping face (7) that the wafer (2) comes to bear in ashock-free manner against the rubberized bearing surface (9) of the bearing ring (10).

Description

technical field [0001] The invention relates to a gripper, especially a Bernoulli suction cup for non-contact gripping of planar components such as silicon-based wafers, comprising: a clamping ring connected with a controllable mechanical arm; The member is connected to the clamping ring, and the stopper includes a gripping surface, which communicates with a flow system through the horn-shaped member and the stopper, and applies a Bernoulli suction cup via the flow system. After overpressure, a negative pressure is generated on the gripping surface of the stop plate for sucking up the wafer to be gripped; and a rubberized bearing surface of a support ring, which is built into the gripping surface, through which A surface provides non-slip movement of the wafer held on the gripping surface; and a sensor is used to identify the wafer held on the gripping surface. Background technique [0002] For example, in the automated production of silicon-based wafers or solar cells that...

AI Technical Summary

Problems solved by technology

In this respect, however, it has been found that the unbraked impact of the correspondingly gripped wafer on the gripping surface of the gripper caused by the suction is a source of danger for wafer damage.

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