Electronic assemblies without solder and methods for their manufacture
A circuit assembly and component technology, which is applied in the direction of electrical components, electrical solid devices, and printed circuits assembled with electrical components, can solve problems such as high energy density that reduce the reliability of electronic products, and achieve improved mechanical shock resistance and improved design. , the effect of good performance
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[0088] In the following description and accompanying drawings, specific terms and reference numerals are explained in detail to provide a thorough understanding of the present invention. In some instances, the terms and labels may contain specific details not required to practice the invention. For example, an interconnect between conductor elements of a component (i.e., an I / O lead of a component) may be shown or described as having multiple conductors interconnected to one lead or connected to multiple component contacts within or between devices. A conductor signal line. Thus, each of the plurality of conductor interconnections may alternatively be a signal, control, power or ground line of one conductor, and vice versa. Circuit paths shown or described as single-ended may also be different, and vice versa. Interconnect assemblies can consist of standard interconnects; microstrip or stripline interconnects and all signal lines of the assembly can be shielded or unshielded...
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Abstract
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