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Keyboard panel

A keyboard and substrate technology, applied in the direction of electrical connection of printed components, printed circuit components, electrical components, etc., can solve the problems of high manufacturing cost and numerous manufacturing processes, and achieve the effect of reducing manufacturing cost, reducing manufacturing process and low cost.

Inactive Publication Date: 2010-03-17
HUAWEI DEVICE (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Using copper foil as a conductive medium requires multiple steps such as exposure, development, etching, and copper plating. After the production is completed, the exposed copper foil needs to be surface treated, and the non-exposed copper foil needs to be coated with green oil. The production process is complicated; Copper foil is used as raw material, and the production cost is relatively high

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0020] This embodiment provides a keyboard board, such as figure 1 , figure 2 As shown, the keyboard board includes: a PCB substrate 10, a plurality of key pads 11 arranged on the first surface 101 of the PCB substrate 10 through carbon film printing patterns; the key pads 11 include an inner ring 111 and an outer The ring 112 is on the first surface 101 of the PCB substrate 10 , and the outer ring 112 is connected by a carbon film wiring 113 .

[0021] Wherein, the carbon film has conductivity; the PCB substrate 10 can be made of FR4 (epoxy fiberglass board) material, but not limited thereto.

[0022] In order to complete all the lines on the same layer, the outer ring 112 of the button pad 11 is open to form a non-closed ring. On the first surface 101 of the PCB substrate 10, the inner ring 111 passes through the The opening of the outer ring 112 is connected by a carbon film wiring 114. In this way, the inner ring 111 can also realize the surface wiring. All lines are c...

Embodiment 2

[0039] Different from the first embodiment, the second surface of the PCB substrate can also be printed with a carbon film pattern, and the outer ring of the key pad forms a closed ring.

[0040] Such as Figure 5 , Figure 6 As shown, the outer ring 112 of the button pad 11 forms a closed ring, and a through hole 14 is opened at the position of the inner ring 111 of the button pad 11 on the first surface 101 of the PCB substrate 10. The through hole 14 is plugged with carbon film, and the inner ring 111 of the button pad 11 passes through the through hole 14 , and is connected with the carbon film wiring 15 on the second surface 102 of the PCB substrate 10 .

[0041] Wherein, the implementation of the key graphics, wiring, current adjusting resistors, devices or graphics connected to other single boards, backlight and large-area ground network of the keyboard board is the same as that of Embodiment 1, and will not be repeated here. .

[0042]The keyboard board of the embod...

Embodiment 3

[0044] Same as Embodiment 1, the outer ring opening of the button pad 11 in this embodiment forms a non-closed ring, and all the lines can be completed on the first surface of the PCB substrate; the difference from Embodiment 1 is , the second surface of the PCB substrate can also be printed with carbon film graphics.

[0045] Such as Figure 7 As shown, the first surface 101 of the PCB substrate 10 is provided with a ground network 16 with a carbon film printed pattern, and the second surface 102 of the PCB substrate 10 is fully laid with a ground network 17 with a carbon film printed pattern. The first surface 102 of the PCB 10 is provided with a through hole 18 at the position where the ground network 16 is provided, and the through hole 18 is plugged with a carbon film; thus, the ground network 17 of the second surface 102 of the PCB substrate 10 can pass through the The through hole 18 is connected to the ground network 16 of the first surface 101 of the PCB substrate 10...

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PUM

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Abstract

The embodiment of the invention discloses a keyboard panel. The keyboard panel comprises a PCB substrate and a key bonding pad which is arranged on a first surface of the PCB substrate by a carbon membrane printing graph; the key bonding pad comprises an inner ring and an outer ring, and the outer ring is connected by carbon membrane wiring on the first surface of the PCB substrate. The keyboard panel is applicable to terminal equipment.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a keyboard board. Background technique [0002] At present, existing keyboard boards usually use copper foil as a conductive medium, and the lines and device pads on the PCB substrate are all made of copper foil. After the circuit is made, the exposed copper foil needs to be treated with chemical nickel gold, etc., and the non-exposed copper foil needs to be coated with green oil. The device is welded on the pad of the PCB substrate by soldering, and the via holes on the PCB substrate are connected by copper plating on the hole wall. [0003] In the process of realizing the present invention, the inventor finds that there are at least the following problems in the prior art: [0004] Using copper foil as a conductive medium requires multiple steps such as exposure, development, etching, and copper plating. After the production is completed, the exposed copper foi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H13/78H01H13/715H05K1/11
Inventor 沈晓兰林蕾
Owner HUAWEI DEVICE (SHENZHEN) CO LTD
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