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Epoxy resin composition used for shielding deep well submersible pump and casting method thereof

A deep-well submersible pump and epoxy resin technology, which is applied to the components, pumps, and pump components of pumping devices for elastic fluids, can solve the problem that epoxy resin does not meet market demand, human health hazards, and use costs. Advanced problems, to achieve the effects of excellent mechanical properties, improved adhesion strength, and low shrinkage

Active Publication Date: 2010-03-17
TAIZHOU HAPPY WATER PUMP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the cashew amine curing agent requires Mannich reaction for synthesis, and the toxic chemical substance formaldehyde solution is used in the synthesis process. Although the toxicity is a little lower, it still has a harmful effect on human health, and after the curing agent is synthesized, it can be used The cost is high, and the application of epoxy resin does not meet the market demand

Method used

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  • Epoxy resin composition used for shielding deep well submersible pump and casting method thereof
  • Epoxy resin composition used for shielding deep well submersible pump and casting method thereof

Examples

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Embodiment 2

[0036] The bisphenol A type epoxy resin described in embodiment 2 is bisphenol A type epoxy resin 6101, and described cashew nut shell oil solidifying agent is cashew nut shell oil solidifying agent 2015, and described filler is that particle size is 500-800 The purpose is active silica powder, and the curing accelerator is a tertiary amine curing accelerator DMP-30.

Embodiment 3

[0037] The bisphenol A type epoxy resin described in embodiment 3 is bisphenol A type epoxy resin 634, and described cashew nut shell oil solidifying agent is cashew nut shell oil solidifying agent 2544, and described filler is that particle size is 400-600 The purpose is active silica powder, and the curing accelerator is a tertiary amine curing accelerator N-benzyldimethylamine.

Embodiment 4

[0038] Bisphenol A type epoxy resin described in embodiment 4 is bisphenol A type epoxy resin 618, and described cashew nut shell oil curing agent is cashew nut shell oil curing agent 2041 and cashew nut shell oil curing agent 2015, both The weight ratio is 7:3, the filler is active silica powder with a particle size of 500-800 mesh, and the curing accelerator is a tertiary amine curing accelerator DMP-30.

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Abstract

The invention provides an epoxy resin composition used for shielding a deep well submersible pump and a casting method thereof, belonging to the technical field of polymer material application and solving the problems that the existing epoxy resin curing agent has toxicity and high cost. The epoxy resin composition used for shielding the deep well submersible pump comprises the following components by weight portions: 100 portions of bisphenol A epoxy resin, 50 to 120 portions of cashew nut shell oil curing agent, 100 to 300 portions of packing, and 0.1 to 5 portions of curing promoter. The casting method comprises the following steps: A. stirring; B. vacuum casting; and C. curing. The epoxy resin composition used for shielding the deep well submersible pump has wide material source, low price and no toxicity; the casting method adopts the epoxy resin composition as an encapsulating material for shielding a motor stator of the deep well submersible pump and can have effects of insulation, fixing, damping, heat resistance and sealing.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition for shielding a deep well submersible pump and a pouring method thereof; it belongs to the technical field of polymer material application. Background technique [0002] Epoxy resins generally refer to organic polymer compounds containing two or more epoxy groups in their molecules, and their relative molecular weights are not high except for a few. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can undergo cross-linking reactions with various types of curing agents to form insoluble, infusible high polymers with a three-dimensional network structure. Epoxy resins are generally used together with additives to obtain application value. Additiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62F04D29/02
Inventor 管敏成庾耀利
Owner TAIZHOU HAPPY WATER PUMP
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