Method for rapidly overhauling PCBA line fault of mobile phone

Abstract

The invention provides a method for rapidly overhauling a PCBA line fault of a mobile phone, comprising the following steps: taking out poor PCBA boards and turning off all power sources thereof; selecting a diode measuring shift of a digital multimeter; connecting a red pen-shaped meter of the digital multimeter with the ground wire of the PCBA board and connecting a black pen-shaped meter of thedigital multimeter with a data signal point to be tested; observing the voltage display of the digital multimeter; confirming that the digital multimeter has a voltage display of 0.4-0.8V if the tested data signal and the relevant chip line and PCB board are under normal state, and confirming that the multimeter has no display if the tested data signal and the relevant chip line or PCB board aredisconnected; and measuring other data signals in turn to check where the fault point occurs.

Description

technical field [0001] The invention belongs to the field of mobile communication, and in particular relates to a method for quickly checking and repairing the faults of PCBA lines of mobile phones. Background technique [0002] At present, the integration of mobile phone communication chips with various functions is getting higher and higher, and they are basically packaged in BGA, while the mobile phone PCB board has about 6 to 8 layers, and the layers are very tightly combined, making it difficult to find faults. In the process of mobile phone PCBA production, we often encounter bad phenomena such as BGA chip soldering and PCB board open circuit, resulting in failure to download programs, failure to boot and other failures. Due to the many control lines, address lines, and data lines of the chip, coupled with the peripheral circuits, it is very difficult to accurately and quickly determine which signal point is disconnected from the PCB. At present, maintenance personnel...

AI Technical Summary

Problems solved by technology

[0002] At present, the integration of mobile phone communication chips with various functions is getting higher and higher, and they are basically packaged in BGA, while the PCB boards of mobile phones are all about 6 to 8 layers, and the layers are very tightly combined, making it difficult to find faults.

In the process of mobile phone PCBA production, we often encounter bad phenomena such as BGA chip soldering and PCB board disconnection, which cause failures such as failure to download programs, failure to boot, etc.

Due to the many control lines, address lines, and data lines of the chip, coupled with the peripheral circuits, it is very difficult to accurately and quickly determine which signal point is disconnected from the PCB board

At present, maintenance personnel basically remove the chip and measure its on-off one by one with the multimeter resistance file, or use a spectrum analyzer to analyze and blindly solder the PCBA. These two methods are very time-consuming and laborious, and the maintenance efficiency is low. Therefore, how to quickly and efficiently determine the fault point is a concern of every maintenance personnel and production plant

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