Novel wafer fixing structure

Abstract

The invention provides a novel wafer fixing structure which makes up the deficiency of the prior lead frame or wafer holder and leads lighting angles of different lighting wafers when in lighting and conducting by fixing to be same and mixed light of the lighting wafers when in lighting to be uniform. The novel wafer fixing structure comprises a wafer holder and lighting wafers, wherein the wafer holder is provided with a plane wafer-fixing region which is internally provided with a concave wafer-fixing region, and the lighting wafers are fixed into corresponding wafer-fixing regions. The novel wafer fixing structure fixes the lighting wafers with different thickness in the plane wafer-fixing region and the concave wafer-fixing region respectively in a punching or etching mode through the arrangement of the concave wafer-fixing region in the plane wafer-fixing region of the wafer holder so as to lead the light heights among the light wafers to be consistent, thereby improving the lighting angle of the light wafers so as to lead the light mixing effect to be uniform when in lighting so that the purpose of the invention is achieved.

Description

technical field [0001] The invention relates to a fixing structure, in particular to a novel chip fixing structure for fixing a light-emitting chip on a lead frame or a chip carrier. Background technique [0002] At present, the fixation of light-emitting chips is achieved by using traditional lead frames or chip carriers, and the bottom of traditional lead frames or chip carriers is a flat die-bonding area as a whole, but since the thickness of the light-emitting chips is not Similarly, when the light-emitting chip is fixed in the plane die-bonding area of ​​the traditional lead frame or chip carrier and conducts light, the light-emitting angles between the light-emitting chips are not the same, resulting in differences in the light-emitting angles between the light-emitting chips. If it is too large, it will cause uneven light mixing between the light emitting chips after emitting light. [0003] Take the traditional 3-4 element material light-emitting chip and GAN materi...

AI Technical Summary

Problems solved by technology

[0002] At present, the fixation of light-emitting chips is achieved by using traditional lead frames or chip carriers, and the bottom of traditional lead frames or chip carriers is a flat die-bonding area as a whole, but since the thickness of the light-emitting chips is not Similarly, when the light-emitting chip is fixed in the plane die-bonding area of ​​the traditional lead frame or chip carrier and conducts light, the light-emitting angles between the light-emitting chips are not the same, resulting in differences in the light-emitting angles between the light-emitting chips. If it is too large, it will cause uneven light mixing between light-emitting chips

[0003] Take the traditional 3-4 element material light-emitting chip and GAN material light-emitting chip as examples (see figure 1 ), because the thickness of the traditional light-emitting chip made of 3-4 elements is much larger than that of the light-emitting chip made of GAN material, when it is fixed on the chip carrier or lead frame and conducts light, the light-emitting angle of the light-emitting chip made of 3-4 elements is just Significantly larger than the light-emitting angle of the GAN material light-emitting chip, resulting in uneven light mixing between the 3-4 element material light-emitting chip and the GAN material light-emitting chip when emitting light

[0004] Obviously, when the existing lead frames or chip holders used to fix light-emitting chips are used to fix light-emitting chips of different thicknesses, due to the different thicknesses of the light-emitting chips, the light-emitting angles after power-on and light-emitting are also different, resulting in the difference between each light-emitting chip when emitting light. The light mixing is not uniform, which cannot meet the needs of existing applications; therefore, a new type of chip fixing structure is particularly needed, so that the light emitting angles of different light-emitting chips are the same when they are fixed to conduct light, and the light-emitting chips mix light evenly when emitting light, making up for the existing Insufficiency of the lead frame or wafer carrier

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