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Preparation method of low-cost UMF resin adhesive used for E0-level plywood

A plywood, low-cost technology, applied in the direction of adhesives, adhesive types, aldehyde/ketone condensation polymer adhesives, etc., can solve the problems of complicated operation process and high cost, achieve high reactivity, low cost, and strengthen gluing performance effect

Inactive Publication Date: 2009-10-07
NANJING TECH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although plywood with low formaldehyde emission can be prepared, most of them require post-treatment or adding an expensive additive, the operation process is complicated and the cost is high

Method used

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  • Preparation method of low-cost UMF resin adhesive used for E0-level plywood
  • Preparation method of low-cost UMF resin adhesive used for E0-level plywood

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] In the first step, add 320g of 37% formaldehyde aqueous solution and 73g of the first batch of urea to a 500ml flask, adjust the pH value to 2.0 with 20% ammonium chloride solution, raise the temperature to 95°C, and react for 40min.

[0024] In the second step, adjust the pH value to 8.5 with 15% NaOH solution, add the first batch of melamine 8g and the second batch of urea 30g, and react at 95°C for 30min.

[0025] In the third step, use 20% ammonium chloride solution to adjust the pH value to 5.0, and react at 95°C to the required viscosity of 81mpa·s.

[0026] The fourth step is to adjust the pH value to 6.8 with 20% ammonium chloride solution, and add the second batch of melamine 8g and the third batch of urea 37g. React at 90°C for 40 minutes.

[0027] The fifth step is to adjust the pH value to 8.5 with 15% NaOH solution, add the third batch of melamine 33g, and react at 90°C for 20min.

[0028] The sixth step is to lower the temperature to 70°C, add the fourth...

Embodiment 2

[0030]In the first step, add 320g of 40% formaldehyde aqueous solution and 79g of the first batch of urea to a 500ml flask, adjust the pH value to 1.0 with 20% ammonium chloride solution, raise the temperature to 80°C, and react for 70min.

[0031] In the second step, adjust the pH value to 8.0 with 15% NaOH solution, add the first batch of melamine 8g and the second batch of urea 31g, and react at 80°C for 50min.

[0032] In the third step, use 20% ammonium chloride solution to adjust the pH value to 5.5, and react at 80°C to the required viscosity of 74mpa·s.

[0033] The fourth step is to adjust the pH value to 6.5 with 20% ammonium chloride solution, and add the second batch of melamine 8g and the third batch of urea 40g. React at 80°C for 70 minutes.

[0034] The fifth step is to adjust the pH value to 8.0 with 15% NaOH solution, add the third batch of melamine 33g, and react at 80°C for 80min.

[0035] The sixth step is to lower the temperature to 70°C, add the fourth ...

Embodiment 3

[0037] In the first step, add 320g of 38.5% formaldehyde aqueous solution and 84g of the first batch of urea to a 500ml flask, adjust the pH value to 3.0 with 20% ammonium chloride solution, raise the temperature to 85°C, and react for 50min.

[0038] In the second step, adjust the pH value to 8.5 with 15% NaOH solution, add the first batch of melamine 8g and the second batch of urea 30g, and react at 85°C for 40min.

[0039] In the third step, adjust the pH value to 4.5 with 20% ammonium chloride solution, and react at 85°C to the desired viscosity of 95mpa·s.

[0040] The fourth step is to adjust the pH value to 6.9 with 20% ammonium chloride solution, add the second batch of melamine 8g and the third batch of urea 30g. React at 85°C for 30 minutes.

[0041] The fifth step is to adjust the pH value to 9.0 with 15% NaOH solution, add the third batch of melamine 33g, and react at 85°C for 50min.

[0042] The sixth step is to lower the temperature to 70°C, add the fourth batc...

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PUM

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Abstract

The invention discloses a preparation method of low-cost UMF resin adhesive used for an E0-level plywood. The preparation method of the adhesive is simple and has good reproducibility, lower cost and long storage period. For serayah plywood and poplar plywood pressed by the adhesive, the bonding strength and the formaldehyde emission thereof conform to the requirements of the E0-level plywood. The preparation method adopts the technique of a strong acid method, urea is selected for adding by four batches; melamine is added by three batches; the urea is added by batches, which can play the role of regulating the molecular weight of resin, especially the third adding of the urea not only can degrade macromolecule parts in rearranged molecules, but also can reduce the content of ether linkage therein, thus reducing the formaldehyde emission.

Description

technical field [0001] The present invention relates to a kind of preparation method of resin glue, relate to a kind of E 0 Preparation method of low-cost UMF resin glue for grade plywood. Background technique [0002] Urea-formaldehyde resin is widely used in the manufacture of wood-based panels such as particle board, plywood, medium density board and blockboard due to its easy-to-obtain raw materials, low price, simple manufacturing process, and convenient use. It is one of the largest synthetic adhesives on the market. , accounting for more than 70% of the resin glue used in the wood-based panel industry. However, UF resin glue has two major disadvantages of poor water resistance and release of formaldehyde. Formaldehyde is harmful to human health and is considered a possible carcinogen. Improving water resistance and reducing formaldehyde emission are the focus of modification of urea-formaldehyde resin. [0003] Using melamine to improve the water resistance of urea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/24C08G12/38
Inventor 卜洪忠莫亚莉蒋玉凤姚成
Owner NANJING TECH UNIV
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