Electromagnetic wave-shielding film having near infrared shielding function and transparency function, optical filter and plasma display panel comprising the same
An electromagnetic wave and shielding film technology, which is applied in the direction of optical/shielding devices, magnetic/electric field shielding, electrical components, etc., can solve problems such as insufficient adhesion, difficulty in handling, and increased preparation costs, so as to reduce production costs and improve the preparation process. Effects of simplification and productivity improvement
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Embodiment 1
[0177] 69 g of a copolymer solution containing butyl acrylate (BA) / hydroxyethyl methacrylate (HEMA) dissolved in ethyl acetate, 0.06 g of V-63 (Epolin, INC) based on metal complexes, 0.14 g of Phthalocyanine-based 906B (Nippon Catalyst), 0.037 g of an isocyanate crosslinking agent, and 0.048 g of a silane coupling agent were added to 31 g of methyl ethyl ketone (MEK), followed by mixing with each other to prepare a coating solution.
[0178] The coating solution was applied onto the release substrate film to a thickness of 25 μm, and the release substrate was laminated with the other side of the release substrate to prepare a near infrared ray absorbing adhesive film.
[0179] The prepared film was applied on the electromagnetic wave shielding film to carry out the transparent treatment, and stored for 500 hours under the conditions of high temperature (80° C.) and high temperature and humidity (65° C., relative humidity: 96%), and then measured the permeability luminosity. r...
Embodiment 2
[0181] 69 g of a copolymer solution containing butyl acrylate (BA) / hydroxyethyl methacrylate (HEMA) dissolved in ethyl acetate, 0.06 g of V-63 (Epolin, INC) based on metal complexes, 0.14 g of Phthalocyanine-based 906B (Japan Catalyst), 0.014 g of porphyrin PD-319 (Mitsui Corporation), 0.037 g of isocyanate crosslinking agent and 0.048 g of silane coupling agent were added to 31 g of methyl ethyl ketone (MEK), and then mixed with each other to prepare coating stain solution.
[0182] The coating solution was applied onto the release substrate film to a thickness of 25 μm, and the release substrate was laminated with the other side of the release substrate to prepare a near infrared ray absorbing adhesive film.
[0183] The prepared film was applied on the electromagnetic wave shielding film to carry out the transparent treatment, and stored at high temperature (80° C.) and high temperature and humidity (65° C., relative humidity: 96%) for 500 hours, and then measured the light...
Embodiment 3
[0185] 69 g of a copolymer solution containing butyl acrylate (BA) / acrylic acid (AA) dissolved in ethyl acetate, 0.06 g of EP4445 (Epolin, INC) based on metal complexes, 0.14 g of phthalocyanine-based 910B (Japan catalyst), 0.137 g of an isocyanate crosslinking agent, and 0.021 g of a silane coupling agent were added to 31 g of methyl ethyl ketone (MEK), and then mixed with each other to prepare a coating solution.
[0186] The coating solution was applied onto the release substrate film to a thickness of 25 μm, and the release substrate was laminated with the other side of the release substrate to prepare a near infrared ray absorbing adhesive film.
[0187] The prepared film was applied on the electromagnetic wave shielding film to carry out the transparent treatment, and stored at high temperature (80° C.) and high temperature and humidity (65° C., relative humidity: 96%) for 500 hours, and then measured the light transmittance Spend. result in Figure 20 described in. E...
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