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Three-silver low radiation film glass

A low-emissivity film and glass technology, applied in the field of triple-silver low-emissivity film glass, can solve the problems of interfering colors in appearance, failure to achieve comprehensive indicators, and reduced visible light transmittance, and achieve good optical stability and good selection coefficient. , the effect of various colors

Inactive Publication Date: 2009-08-05
CSG HOLDING
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the traditional low-emissivity glass processing, in order to achieve a better U value and selectivity coefficient Lsg, it is necessary to increase the thickness of the silver layer in the film layer to reduce the emissivity of the glass film layer, so as to obtain an ideal selectivity coefficient, However, increasing the thickness of the silver layer means that the visible light transmittance decreases, the appearance color presents interference colors, and the range of color choices is limited, which cannot achieve the ideal comprehensive index.

Method used

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Embodiment Construction

[0033] The film structure of the triple-silver low-emissivity film glass provided by the present invention is: glass substrate / basic dielectric composite layer (10-30nm) / first Ag layer (8-35nm) / first barrier layer (1-10nm) / First interlayer dielectric combination layer (38-90nm) / second Ag layer (8-35nm) / second barrier layer (1-10nm) / second interlayer dielectric combination layer (30-110nm) / third Ag layer (8-35nm) / third barrier layer (1-10nm) / first upper dielectric composite layer (10-35nm) / second upper dielectric composite layer (10-30nm).

[0034] Each dielectric film layer is a metal or non-metal oxide or nitride deposited by vacuum sputtering, such as TiO 2 , ZnSnO x , SnO 2 , ZnO, SiO 2 、 Ta 2 o 5 、BiO 2 、Al 2 o 3 , ZnAl 2 o 4 , Nb 2 o 5 、Si 3 N 4 , AZO, etc.

[0035] In practical applications, the film structure and thickness of the commonly used triple-silver low-emissivity film glass are: glass substrate / base dielectric combination layer (15-17nm) / first A...

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Abstract

The invention provides a three-silver low radiation film glass. The film layer structure of the glass comprises glass, a first base layer dielectric combination layer, a first Ag layer, a first blocking layer, a first interlayer dielectric combination layer, a second Ag layer, a second blocking layer, a second interlayer dielectric combination layer, a third Ag layer, a third blocking layer, a first upper layer dielectric combination layer, and a second upper layer dielectric combination layer. The invention also provides a process for producing the glass. The three-silver low radiation film glass and the producing process thereof adopt a unique film layer configuration, the process and a method improve the prior low radiation film glass so that the product has low radiance and good selectivity coefficient Lsg; the indoor and outdoor colors of the glass are close to neutral color without interference colors; and the glass has excellent optical performance, various colors, weather resistance, and the like, and can be widely popularized and applied to vehicle glass and civil architecture glass.

Description

【Technical field】 [0001] The invention relates to the field of special glass, in particular to a triple-silver low-emissivity film glass. 【Background technique】 [0002] Triple-silver low-emissivity film glass (also known as triple-silver LOW-E glass) is a film system product composed of multiple layers of metal or other compounds plated on the surface of the glass, including three layers of silver. Due to the low emissivity of the silver layer, the low emissivity glass has a high transmittance to visible light, a high reflectivity to infrared rays, and good heat insulation performance. [0003] The film structure of ordinary triple-silver low-e film glass produced by vacuum magnetron sputtering is generally: glass / base dielectric combination layer / first Ag layer / first barrier layer / first interlayer dielectric combination layer / second Ag layer / second barrier layer / second interlayer dielectric combination layer / third Ag layer / third barrier layer / upper dielectric combination ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C17/36
Inventor 陈可明曾小绵崔平生
Owner CSG HOLDING
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