Conductive wire type semiconductor device and conductive wire rack thereof

Abstract

The invention discloses a lead frame type semiconductor device and the lead frame thereof. The lead frame which comprises a plurality of signal pins, a plurality of ground pins and a plurality of power supply pins is provided; a plurality of ground pins (or power supply pins) form a chip connecting zone while the other signal pins and power supply pins (or ground pins) are distributed around the chip connecting zone; therefore, the ground pins or the power supply pins are isolated, thus improving the problem of ground bounce and reinforcing electrical property; meanwhile the size of the ground pins (or power supply pins) in the chip connecting zone is larger than the size of the signal pins and the power supply pins (or ground pins) around the chip connecting area, thus a semiconductor chip on the chip connecting zone can have good heat radiation function.

Description

technical field [0001] The invention relates to a semiconductor device, in particular to a lead frame type semiconductor device and its lead frame. Background technique [0002] Traditional lead frame (Lead Frame) type semiconductor packages, as disclosed in patents such as US Pat. lead frame, and stick a chip on the chip holder, then electrically connect the electrode pads (Electrode Pads) on the surface of the chip to the corresponding pins through a plurality of welding wires, and then cover the chip with an encapsulant and bonding wires to form a lead frame semiconductor package. [0003] However, when the above-mentioned traditional lead frame structure design corresponds to the electrical requirements of various chips with different functions and functions, the space for flexible adjustment of the lead layout of the lead frame is really limited, especially for highly integrated and light and thin devices. For chips, the required pin spacing and package size are getti...

AI Technical Summary

Problems solved by technology

[0007] Traditionally, in order to simplify the problem, the power supply and grounding are usually treated as an ideal situation, but in high-speed design, this simplification will make it more and more difficult to predict the behavior of the circuit system after implementation

Although the directly visible result of the circuit design is expressed from the signal integrity, the design of the power integrity must not be ignored because the power integrity will eventually be reflected in the signal integrity after being damaged, and in many In most cases, the main cause of signal distortion and disturbance is the power system, for example: unsatisfactory division of multiple power supply / ground planes, too much ground bounce noise, uneven current distribution, etc.

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