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Wafer container with sealable door

A technology for sealing containers and containers, applied in the field of containers, can solve problems such as leakage of seals, and achieve the effects of reducing contact force, eliminating cylindrical buckling, and being easy to replace.

Active Publication Date: 2009-05-13
ENTEGRIS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem with this approach is the "discrete cylindrical buckling" of the end section, where the free end of the end section buckles radially inwards on one section of the cut edge of the seal, but radially inwards on a section of a different cut edge. buckle outward
This condition allows the seal to leak at the transition point between inward and outward buckling

Method used

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  • Wafer container with sealable door
  • Wafer container with sealable door
  • Wafer container with sealable door

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Refer to Figure 1-2 The well-known wafer container 20 as a transport unit generally includes an outer cover member 22 and a door 24. The cover member 22 generally includes a housing 26 that forms an internal space 28 for housing a plurality of wafers 30. The housing 26 has a pair of opposite side walls 32, 34, a top 36, a bottom 38 and a back 40. The open front 42 is opposed to the back 40 and is formed by a door frame 44 that receives the door 24 for tightly sealing the internal space 28. It should be noted that the "door frame" used here is not limited to a structure separated from the outer cover member 22, nor is it limited to an accessory structure on or integral with the outer cover member 22. On the contrary, the “door frame” only refers to the part of the outer cover member 22 that receives the door 24. The outer cover member 22 may also include a mechanical handle pull flange 46 on the top 36, manual handles 48 on the side walls 32 and 34, and a moving hinge with ...

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Abstract

A wafer container (20) including an enclosure portion (22) with a door frame defining an opening for insertion and removal of wafers and a door (24) fittable in the door frame to seal the enclosure portion. A continuous elastomeric seal (94) extends around the door inward of the periphery. The seal is positioned on a sealing surface proximate the perimeter of the door and may be partially inset in a radial groove (92) in the door. In cross-section, the elastomeric seal has an inset portion (96) and a sealing head (97) coupled by a bridging portion (98). The sealing head has a foot portion (108) projecting from the bridging portion toward the sealing surface of the door, and a head portion (106) extending in a direction generally opposite the foot relative to the bridging portion. The door frame has a seal engaging structure so that when the door is seated in the door frame, the bridging portion of the elastomeric seal contacts the seal engaging structure (112) displacing the bridging portion axially toward the sealing surface and causing the head of the sealing head to rotate radially and contact the seal engaging structure (118). The displacement action also affirmatively sets the foot of the sealing head in contact with the sealing surface of the door (58).

Description

[0001] This application claims the priority of the US provisional application with the application number 60 / 563,529, the filing date of April 18, 2004, and the title "wafer container with sealed door", all of which are incorporated herein by reference. Technical field [0002] The present invention relates to containers, and more specifically, to sealable containers for semiconductor wafers. Background technique [0003] Semiconductor wafers go through many steps in the processing process. This usually requires transporting a large number of wafers between workstations or processing equipment. Semiconductor wafers are very fragile and are easily damaged by physical contact or vibration and static electricity. Moreover, the semiconductor manufacturing process is very sensitive to contamination by particles or chemical substances. Therefore, in order to reduce the harmful effects of contaminants on the wafers, special containers for minimizing the generation of contaminants and iso...

Claims

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Application Information

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IPC IPC(8): B65D53/02B65D43/04B65D85/00B65D85/30H01L21/00H01L21/673
CPCH01L21/67126H01L21/67376B65D85/30B65D85/38H01L21/673
Inventor 安东尼·玛索丝·堤班约翰·里斯塔
Owner ENTEGRIS INC
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