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Large power LED encapsulation method

A LED packaging and high-power technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low production efficiency and poor heat dissipation effect, and achieve the effects of improving production efficiency, reducing filling of silicone resin, and realizing mechanized operation

Inactive Publication Date: 2009-04-01
SHENZHEN WENLIANG ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical purpose of the present invention is to solve the technical problems of poor heat dissipation effect and low packaging production efficiency in the packaging method of LEDs in the prior art; to provide an LED with good heat dissipation effect and high packaging production efficiency in the packaging process. Encapsulation method

Method used

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Embodiment Construction

[0015] refer to figure 2 , which shows a schematic cross-sectional view of a finished LED structure in a high-power packaging method according to the present invention. The structure of the finished product includes lens 11 , inner lead 12 , fluorescent powder 13 , insulating molding material 14 , outer lead (ie, mounting pin) 15 , soldering metal 16 , LED chip 17 , heat conduction column 18 , and heat dissipation substrate 19 .

[0016] In the high-power LED packaging method of the present invention, small granulated solder metal 16 is first placed on the fixed chip of the heat conduction column 18, and then enters the reflow soldering machine for welding, and the LED chip 17 is firmly welded in the middle of the heat conduction column 18; Use a gold wire welding machine to connect the LED chip 17 with the inner lead 12 and the outer lead 15, put phosphor powder 13 on the LED chip 17 and then dry it to form a semi-finished product; prepare for potting the lens; then, after h...

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Abstract

The invention discloses a high-power LED packaging method, belonging to the production field of light-emitting diodes; the invention aims at providing the LED packaging method with good heat radiation effect and high packaging production efficiency during the packaging process; the technical proposal is as follows, an LED chip is welded on a thermal conductive pillar, the LED chip is connected with an external leading wire by an internal leading wire; fluorescent powder is pointed on the LED chip and dried to form a semi-finished product; a heated mold is injected in well mixed potting adhesive of a lens, the heated semi-finished product is inserted in the mold to be potted, molded, dried and released from the mold together with the lens, the method can improve the brightness of a high-power LED finished product and the production efficiency of the LED packaging; and the method is applicable to the applications in the LED production field.

Description

technical field [0001] The invention relates to a method for producing LEDs, and more specifically, to a method for packaging high-power LEDs. Background technique [0002] Existing high-power internal structure (see Figure 1 ), including lens 1, inner lead 2, insulating molding material 3, outer lead (that is, mounting pin) 4, solid crystal glue 5, LED chip 6, lens filling glue 7, heat conduction column 8, heat dissipation 9 substrate, phosphor powder Layer 10 these ten parts. In the prior art high-power LED packaging, how to dissipate heat and mechanize it into mass production during the LED packaging process has become a technical problem. The heat dissipation in the LED packaging process directly affects the luminous brightness and life of the LED product; how to improve the efficiency of mass production is related to the production cost and production cycle. Therefore, how to quickly dissipate heat and mass produce in the production process of high-power LEDs is very...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48
Inventor 黎旭东
Owner SHENZHEN WENLIANG ELECTRONICS
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