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Hole blackening solution and preparation thereof

A technology of black hole solution and suspension solution, which is used in liquid chemical plating, printed circuit manufacturing, printed circuit, etc.

Active Publication Date: 2010-08-25
TSINGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the black porous material carbon black or graphite particles currently used can no longer meet the above requirements.

Method used

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  • Hole blackening solution and preparation thereof
  • Hole blackening solution and preparation thereof
  • Hole blackening solution and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0016] Please refer to Fig. 1, this technical scheme provides a kind of preparation method of black porosity solution, and it mainly comprises the following steps:

[0017] (1) Provide a carbon nanotube raw material, and perform functional treatment on the carbon nanotube raw material.

[0018] In this embodiment, the carbon nanotube raw material can be single-walled or multi-walled carbon nanotubes prepared by arc discharge method, laser evaporation method or chemical vapor deposition method, wherein carbon nanotube arrays grown by chemical vapor deposition method are preferred . In the carbon nanotube array, because the carbon nanotubes are aligned and not entangled with each other, it is beneficial for the carbon nanotubes to disperse in the solution. The aspect ratio of carbon nanotubes is greater than 1000:1. A large aspect ratio is conducive to the formation of a conductive network of carbon nanotubes.

[0019] The above-mentioned carbon nanotube raw material function...

Embodiment

[0044] The carbon nanotube raw material was placed in a furnace at 350° C. and heated in air flow for 2 hours to remove amorphous carbon in the carbon nanotube raw material. Then the remaining carbon nanotube raw material in the furnace was soaked in 36% concentrated hydrochloric acid for 1 day and then centrifuged, and the obtained precipitate was repeatedly washed with deionized water. The purified carbon nanotube raw material was obtained by filtering through a polytetrafluoroethylene membrane with a pore size of 0.2 mm. 80 mg of the purified carbon nanotube raw material was heated under reflux in 2.6 M nitric acid for 48 hours, and filtered through a filter membrane with a pore size of 100 nm to obtain a carbon nanotube solid. Repeated washing with deionized water until the pH value of the filtrate was 7. A certain amount of the functionalized carbon nanotubes and a certain amount of potassium carbonate were weighed. Mix the above potassium carbonate and the functionaliz...

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Abstract

The invention discloses a black hole solution and a preparation method thereof. The black hole solution comprises carbon nanotubes, a surface active agent, an alkaline matter and a proper amount of liquid solvent, wherein the carbon nanotubes are stably dispersed in the black hole solution under the action of a dispersant after being subjected to functionalization processing. The preparation method comprises the following steps: providing a carbon nanotube material; conducting functionalization processing for the carbon nanotube material; mixing the functionalized carbon nanotubes with the alkaline matter; adding the mixture into the liquid solvent to obtain a suspended solution; adding the surface active agent into the suspended solution; and mechanically agitating the suspended solutionto obtain the black hole solution.

Description

technical field [0001] The invention relates to a conductive solution, in particular to a black hole-forming solution used in the through-hole metallization process of printed circuit boards and a preparation method thereof. Background technique [0002] Through-hole metallization is one of the most critical process links in the manufacturing process of multilayer printed circuit boards. It plays a major role in the formation of later circuits and the conduction of upper and lower circuits. Through hole metallization means that after the pretreatment of each layer of printed wires in the through hole, the hole wall of the insulating resin is plated with a layer of conductive metal by means of chemical plating and electroplating, so that the printed wires of each layer are connected. craft. [0003] Black hole / copper plating technology (see, Printed Circuit Board Hole Metallization Electroplating Process, Electroplating and Finishing, Pages 61-65, Volume 12, No. 3 (1993)) pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42C25D5/54
CPCB82Y10/00H05K2201/026C23C18/127C23C18/1204H05K3/424C23C18/1287H05K2201/0323H05K3/427
Inventor 林承贤白耀文张睿李文钦
Owner TSINGHUA UNIV
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