Tungsten aluminum-copper alloy sintered body and preparation thereof

A sintered body and copper alloy technology, applied in the field of tungsten-aluminum-copper alloy sintered body and its manufacturing method

Inactive Publication Date: 2009-03-04
CHANGZHOU INST OF ENERGY STORAGE MATERIALS &DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

So far, there is no report on the research on this alloy sintered body at home and abroad.

Method used

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  • Tungsten aluminum-copper alloy sintered body and preparation thereof
  • Tungsten aluminum-copper alloy sintered body and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Embodiment 1: 30 grams (W 0.9 Al 0.1 ) alloy and 3.33 grams of copper powder are mixed and cold-pressed, put into a graphite mould, put into a vacuum hot-press sintering machine, at 10 -2 Hot-pressing sintering under Pa vacuum condition, sintering temperature is 1400°C, pressure is 40MPa, and sintering time is 30 minutes to obtain tungsten-aluminum-copper alloy sintered body. The relative density is 99%. Conductivity 23.3MS / m -1 , microhardness 4.13GPa, bending strength 784MPa.

Embodiment 2

[0012] Embodiment 2: will be 25 grams, (W 0.75 Al 0.25 ) alloy and 2.78 grams of copper powder are mixed and cold-pressed, put into a graphite mold, put into a vacuum hot-press sintering machine, -2 Hot-pressing sintering under Pa vacuum condition, sintering temperature is 1400°C, pressure is 40MPa, and sintering time is 30 minutes to obtain tungsten-aluminum-copper alloy sintered body. The relative density is 99%. Conductivity 24.4MS / m -1 , microhardness 4.31GPa, bending strength 791MPa.

Embodiment 3

[0013] Embodiment 3: 20 grams (W 0.5 Al 0.5 ) alloy and 2.22 grams of copper powder are mixed and cold-pressed, put into a graphite mould, put into a vacuum hot-press sintering machine, at 10 -2 Hot-pressing sintering under Pa vacuum condition, sintering temperature is 1400°C, pressure is 40MPa, and sintering time is 30 minutes to obtain tungsten-aluminum-copper alloy sintered body. The relative density is 99%. Conductivity 24.8MS / m -1 , microhardness 4.50GPa, bending strength 850MPa.

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Abstract

The invention relates to a tungsten aluminum-copper alloy sintered body and a preparation method thereof; the tungsten aluminum-copper alloy sintered body is composed of tungsten aluminum powder and copper powder; the expression formula of the tungsten aluminum powder is W1-xAlx, wherein, x is equal to 0.1 to 0.86; the mass proportion of the copper powder in the sintered body is 5 percent to 80 percent. The preparation method comprises the following steps: the tungsten aluminum powder and the copper powder serve as raw materials, and are sintered under vacuum condition and through hot pressing, to prepare an alloy sintered body sample with high compaction and excellent performance. An alloy lump-shaped material with good crystal morphology and microstructure is synthesized by changing the mass percentage of nickel and controlling sintering temperature, pressure, time and other conditions. The properties of the alloy are as follows: the electrical conductivity is 21.1MS / m<-1> to 29.4MS / m<-1>, the microhardness is 3.50 Gpa to 4.74Gpa, and the bending strength is 760Mpa to 1200Mpa.

Description

technical field [0001] The invention belongs to a tungsten-aluminum-copper alloy sintered body and a preparation method. It specifically relates to the preparation of a tungsten-aluminum-copper alloy sintered body by using tungsten-aluminum powder as a raw material and copper as a binding phase through vacuum sintering and hot-pressing sintering techniques. Background technique [0002] The main development direction of high-performance structural materials is to study new materials with high strength, high toughness, high hardness, light weight, high oxidation resistance and good processability. Tungsten-copper alloy is a pseudo-alloy composed of high melting point, high hardness tungsten and high electrical conductivity and high thermal conductivity copper. It is widely used as electrical contact material, resistance welding, EDM and plasma electrode material, electric heating Alloys and high-density alloys, special-purpose military materials (such as rocket nozzles, airc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C27/04C22C21/00C22C1/04B22F3/12
Inventor 马贤锋乔竹辉汤华国赵伟刘建伟
Owner CHANGZHOU INST OF ENERGY STORAGE MATERIALS &DEVICES
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