Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat radiation model set and its fin group

A heat dissipation module and heat sink technology, which is applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve the problem of affecting the heat dissipation performance of the heat dissipation module, the heat of the heat sink cannot be removed in time, Inability to make full use of the heat dissipation fan to cool the airflow and other issues, so as to improve the heat dissipation performance and increase the contact area

Inactive Publication Date: 2009-02-18
FU ZHUN PRECISION IND SHENZHEN +1
View PDF0 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the air volume and wind speed of each air outlet of the cooling fan are different. If the cooling fins are set to the same size, the cooling airflow generated by the cooling fan cannot be fully utilized, and the heat on the cooling fins cannot be removed in time, affecting Thermal performance of the entire cooling module

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat radiation model set and its fin group
  • Heat radiation model set and its fin group
  • Heat radiation model set and its fin group

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] Figure 1 to Figure 3 Shown is one of the preferred embodiments of the heat dissipation module of the present invention, the heat dissipation module is used to be installed in portable electronic devices such as notebook computers to dissipate heat from the heat-generating electronic components inside it, such as central processing units, graphics card chips, etc. . The cooling module includes a centrifugal fan 20 , a fin set 30 , a heat pipe 40 and a heat collecting block 50 .

[0014] The centrifugal fan 20 includes a casing 21 and a rotor 22 with a plurality of fan blades. The rotor 22 is installed in the casing 21 and can rotate counterclockwise around its axis. The housing 21 includes a base 212 and an upper cover 214 disposed on the base 212. The upper cover 214 is a plate with a circular air inlet 23 in the center for the outside air to enter the centrifugal fan 20. Inside. A rectangular air outlet 24 is defined laterally of the housing 21 , and two ends of th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A radiation module group comprises a centrifugal fan and fin set. The centrifugal fan comprises a rotor and a wind outlet including a wind-near side and wind-far side positioned at two ends and middle area between wind-near side and wind-far side, the fin set, disposed at wind outlet, includes several radiation sheets. The radiation sheet corresponding to wind-near side and wind-far side is longer than that in middle area to form a stepped shape on the side corresponding to centrifugal fan rotor and a linear type of other side far from centrifugal fan rotor, thus promoting utilization rate of cooling air current provided by radiation fan, enlarging contact area of radiation sheet and air current, and promoting radiation performance of whole radiation module group.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module and its fin group for heat dissipation of electronic components. Background technique [0002] As the power of electronic components such as a central processing unit (CPU) continues to increase, people pay more and more attention to heat dissipation, especially in various portable electronic devices such as notebook computers. In order to efficiently remove the heat generated by the system in a limited space, the industry currently mainly uses a heat dissipation module composed of heat sinks, heat pipes, and heat dissipation fans to dissipate heat from electronic components such as CPUs. The heat conduction path of this method is: the heat generated by the CPU is transferred to the heat sink through the heat pipe, and then the airflow generated by the cooling fan will take away the heat transferred to the heat sink. [0003] Traditional cooling fins are arr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/367H01L23/467
CPCF28D15/0233H01L23/467H01L23/427H01L23/4006H01L2924/0002G06F1/203H01L2924/00
Inventor 黄清白张杰
Owner FU ZHUN PRECISION IND SHENZHEN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products