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Copper coated substrate material and flexible circuit board having the copper coated substrate material

A technology for flexible circuit boards and substrates, which is applied in the directions of printed circuits, printed circuits, and printed circuit manufacturing, and can solve the problems of low substrate yield, easy disconnection, and high price.

Inactive Publication Date: 2009-02-11
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the production of fine lines, thinner copper foil has a higher yield, but its price is higher, and it is easy to break during the crimping process of multi-board interconnection
Therefore, if the same flexible circuit board needs to make fine lines on the rolled copper foil on one surface, etch the rolled copper foil on the other surface to set up side joints for multi-board interconnection. The yield rate during circuit fabrication and crimping is low

Method used

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  • Copper coated substrate material and flexible circuit board having the copper coated substrate material
  • Copper coated substrate material and flexible circuit board having the copper coated substrate material
  • Copper coated substrate material and flexible circuit board having the copper coated substrate material

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Embodiment Construction

[0014] The technical solution will be further described below in conjunction with multiple embodiments and drawings.

[0015] see figure 1 , which is the first embodiment of the copper-clad substrate provided by the technical solution. The copper-clad substrate 10 includes an insulating substrate 3 , a first copper foil 1 and a second copper foil 4 located on opposite sides of the insulating substrate 3 . The first copper foil 1 is an electrolytic copper foil, and the second copper foil 4 is a rolled copper foil. The insulating substrate 3 is polyimide resin or other insulating resin commonly used in flexible circuit boards, such as polyethylene, polyethylene terephthalate, polytetrafluoroethylene, polythioamine, polymethacrylate ester, polycarbonate or polyimide-polyethylene-terephthalate copolymer, etc. The first copper foil 1 can be directly formed on one surface of the insulating substrate 3 by hot pressing, and the second copper foil 4 can be directly formed on the oth...

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Abstract

The invention relates to a copper pour substrate and a flexible circuit board using the copper pour substrate. The copper pour substrate comprises an insulating substrate, and a rolled copper foil and an electrolytic copper foil which are positioned at both opposite sides of the insulating substrate respectively. The flexible circuit board comprises the insulating substrate, and a conductive circuit and edge connectors which are arranged at both opposite sides of the insulating substrate respectively. The conductive circuit is made of rolled copper foils, and the edge connectors is made of electrolytic copper foils. The invention has the advantages of low cost, good mechanical properties, convenience for multi-board interconnection, and wide application in manufacturing field of flexible printed circuit boards.

Description

technical field [0001] The invention relates to the field of flexible printed circuit boards, in particular to a copper-clad base material and a flexible circuit board using the copper-clad base material. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board, FPC) has the advantages of free bending, winding, folding, arbitrary arrangement according to space layout requirements, and arbitrary movement and expansion in three-dimensional space, good heat dissipation and solderability. , to meet the needs of electronic products in the direction of high density, miniaturization, and high reliability, so they are widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDAs, and digital cameras. [0003] Flexible printed circuit boards are generally made of copper-clad substrates through related processes, see literature: Traut, G.R; Rogers Corp., CT; Manufacturing and integration techniques of microw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09
CPCH05K3/022H05K1/0393B32B15/06H05K2201/0355H05K2203/0723B32B15/20H05K1/09B32B27/308B32B2457/08B32B15/08H05K2201/0352Y10T428/31678H05K3/384H05K1/036Y10T428/26B32B27/281
Inventor 候宁刘兴泽
Owner AVARY HLDG (SHENZHEN) CO LTD
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