Memory module encapsulation construction and encapsulation method thereof

Abstract

The invention relates to a memory module enclosure and an encapsulation method. A die, surrounding a chip, is arranged on a carrier plate to limit the flow and distribution range of fluid sealant and to equalize the thicknesses of the areas covered by the fluid sealant so as to avoid that pull to the enclosure is uneven after the fluid sealant in all the areas is solidified, thus preventing the enclosure from deforming due to uneven pull and improving the reliability of the enclosure. The invention uses the die to protect the leads during the fabrication process of the enclosure, thus preventing the leads from damages caused by collision.

Description

technical field [0001] The present invention relates to a packaging structure of a memory module and a packaging method thereof, in particular to a packaging structure of a memory module and a packaging method thereof produced by Chip On Board (COB for short). Background technique [0002] With the increasing popularity and multi-functionality of electronic products, memory modules are used in many electronic products, such as computers, mobile phones, PDAs, etc., resulting in an increasing demand for memory modules. As the demand increases, memory modules are also required Modules can have larger capacity and higher performance. Therefore, how to manufacture or package memory modules with large capacity, high performance and low cost has always been a major issue in the production and packaging of memory modules. [0003] Referring to FIG. 1 , it is a three-dimensional schematic diagram of a package structure of a general memory module on the market. Generally speaking, th...

AI Technical Summary

Problems solved by technology

As shown in Figure 1, because the black glue covering the top of the component is half-curved, it is difficult for the machine to accurately grasp the component during surface mount (SMT), and it is easy to cause problems such as component throwing, displacement, and short circuit.

[0011] Secondly, from the perspective of imprinting the components after the packaging is completed, because the black glue hardens to form a half arc instead of a flat surface, it is not easy to print clearly and beautifully whether it is stamped with ink or laser

From the perspective of the memory module, the packaging structure is half-curved instead of flat, which makes it difficult to install the heat sink, or the contact area with the heat sink is small, resulting in poor heat dissipation and other problems.

In addition, compared with the existing packaging structure, the overall appearance of the finished product is relatively poor because of its semi-curved shape.

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