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Loading belt for smart card, encapsulation module for smart card using the same and manufacturing method thereof

A smart card and carrier tape technology, which is applied in the recording carrier used in machines, semiconductor/solid-state device manufacturing, instruments, etc., can solve the problems of many technological processes, high PCB cost, and low packaging efficiency

Inactive Publication Date: 2009-01-28
SAMSUNG SEMICON CHINA RES & DEV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the smart card carrier tape mainly uses resin substrates, the PCB cost is relatively high, and the gold wire bonding process is used, which requires many processes and the packaging efficiency is not high.

Method used

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  • Loading belt for smart card, encapsulation module for smart card using the same and manufacturing method thereof
  • Loading belt for smart card, encapsulation module for smart card using the same and manufacturing method thereof
  • Loading belt for smart card, encapsulation module for smart card using the same and manufacturing method thereof

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Embodiment Construction

[0018] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0019] In the following detailed description, only specific exemplary embodiments of the present invention are simply shown and described by way of illustration. As those skilled in the art know, the described embodiments can be modified in many different ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions should be regarded as illustrative in nature and not restrictive. The same reference numerals indicate the same elements throughout the specification.

[0020] First, refer to image 3 with Figure 4 A smart card carrier tape according to an exemplary embodiment of the present invention will be described. image 3 Is a schematic diagram of a smart card carrier tape according to an exemplary embodiment of the present invention, Figure 4 Is a schematic diagram of a tape carrier ...

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PUM

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Abstract

The invention provides a carrier tape for an intelligent card, a packaging module for the intelligent card adopting the carrier tape and a method for making the same. The carrier tape for the intelligent card has an open window, a beam lead is led out from each contact pin to the middle part of the open window; and at least one part of the front end of the beam lead is positioned in the same horizontal line. The packaging module for the intelligent card comprises the carrier tape, a semiconductor chip and a colloid, wherein the semiconductor chip is adhered to the lower surface of the carrier tape faceup from a bonding pad under the carrier tape through adhesive; and after adhered to the carrier tape, the bonding pad of the semiconductor chip is positioned in the middle of the open window. A tape automated bonding (TAB) process is adopted to realize bonding between all bonding pads and corresponding beam leads at one time, thereby improving packaging efficiency and reducing manufacturing cost.

Description

Technical field [0001] The invention relates to a smart card design structure, in particular to a smart card carrier tape, a smart card packaging module using the carrier tape, and a manufacturing method thereof. Background technique [0002] The current packaging forms of smart cards are mainly gold wire bonding and flip chip bonding. Usually in order to realize the function of the smart card module, the existing technology is a smart card module composed of a printed circuit board (smart card carrier tape) with one or two layers of circuits, silver paste, chips, gold wires and plastic encapsulant to protect the chip Packaging technology. [0003] figure 1 Shows a traditional smart card carrier tape, figure 2 It is a cross-sectional view of a traditional smart card module. [0004] Usually smart card modules use wire bonding processes, such as figure 2 As shown, the aluminum pad 2 of the chip 300 and the contact point 3 of the smart card are connected by the gold wire 1, and...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L23/488H01L23/13H01L23/31H01L21/50G06K19/077
CPCH01L2924/0002
Inventor 黄玉财
Owner SAMSUNG SEMICON CHINA RES & DEV
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