Integrated circuit structure for test

Abstract

The invention discloses an integrated circuit structure for testing, which is positioned in a cutting channel region and comprises a first / a second testing keys, a first / a second conducting electrical connectors, a first / a second testing welding pads and a protective layer, wherein the first / the second testing keys comprise a first / a second active circuit elements which are collocated in a substrate of the cutting channel region and a first / a second inner connecting wires which are electrically connected with the first / the second active circuit elements. The second testing key and the first testing key are basically arranged in parallel. The first / the second conducting electrical connectors are positioned on the first / the second inner connecting wires and are connected with the upmost metallic layer of the second inner connecting wire. The first / the second testing welding pads are collocated above the first and the second testing keys and are contacted with the first / the second conducting electrical connectors. The protective layer is provided with a first opening which exposes a part of the first / the second testing welding pads and a second opening which exposes a part of the second welding pad.

Description

Technical field [0001] The present invention relates to an integrated circuit structure, and particularly relates to a test integrated circuit structure that can improve the space utilization rate of a cutting lane. Background technique [0002] After the wafer is manufactured and before dicing and packaging, a wafer acceptance testing (WAT) method is commonly used to measure the yield of semiconductor components on the wafer. In this method, around the die on the wafer, that is, on the wafer with multiple scribe lines that are parallel and perpendicular to each other, multiple test keys are specially provided. These test keys will then be electrically connected to external circuits or probes for probe cards through pads for testing, so as to monitor the quality of each stage of the process. Generally, the component structure generally formed on the die is mainly used to participate in logic operations or memory functions, and a similar component structure is also formed on the c...

AI Technical Summary

Problems solved by technology

In this way, it will also cause a substantial increase in process costs

[0005] Therefore, it can be seen that due to the limitation of the current process technology, it is impossible to improve the space utilization rate of the dicing line of the wafer and reduce the manufacturing cost, so how to solve this problem has become one of the goals that the industry is actively striving to develop.

Images