Non-condensation system in a low temperature environment

Abstract

The invention provides a low temperature environment free of condensed system, comprising a refrigeration air supply cooling device, a refrigeration liquid supply cooling device, a constant temperature surging tank, a PLC control box, wherein a cold plate is arranged in the constant temperature surging tank, the refrigeration liquid supply cooling device is connected with the cold plate through a liquid supply pipe and a liquid return pipe, while the refrigeration air supply cooling device is connected with the constant temperature surging tank through an air supply pipe and an air return pipe. The PLC control box respectively controls the refrigeration liquid supply cooling device and the refrigeration air supply cooling device. The refrigeration liquid supply cooling device keeps the temperature of the cold plate in -10 to 50 DEG C, and the refrigeration air supply cooling device keeps the temperature in the constant temperature surging tank a little lower than the dewpoint temperature of the cold plate, thereby ensuring no condensation in the constant temperature surging tank. Pressure in the constant temperature surging tank is not lower than 800 Pa, causing highly wet air outside not to enter the tank, thereby increasing working reliability of cold plate. The system is reliable in operation, high efficient in heat emission, which builds a low temperature environment free of condensation, thereby effectively protecting the electronic device.

Description

technical field [0001] The invention relates to a low-temperature environment non-condensation system, which is suitable for low-temperature environments without condensation requirements. Background technique [0002] In order to make the electronic equipment work stably and reliably, the electronic equipment can be cooled by direct air blowing and the electronic equipment is installed on the cold plate with liquid cooling. The cooling effect of the air cooling method is not ideal, and the liquid cooling method has a better effect. However, when the simulated temperature of the working environment of electronic equipment is -40°C ~ +50°C, liquid is used for cooling, and the electronic components are prone to condensation, and the operation is unreliable. Contents of the invention [0003] In order to overcome the disadvantages of the prior art above, the object of the present invention is to provide a non-condensing system in a low-temperature environment, which is reliab...

AI Technical Summary

Problems solved by technology

However, when the simulated temperature of the working environment of electronic equipment is -40°C ~ +50°C, liquid is used for cooling, and the electronic components are prone to condensation, and the operation is unreliable.

Images