Method of manufacturing nano-carbon packaged copper nano-particle and application of the same as heat conduction filling material

Abstract

The invention discloses a preparation method of copper nano-particles packed by nano-carbon and the application as thermal conducting fillers. The preparation method of the invention is as following: the pure copper powder with the mass percentage of 90 to 10 percent and the pure graphite powder with the mass percentage of 10 to 90 percent are blended to make into an anode composite rod; Ar gas is input into a vacuum response chamber with the response voltage of 20 to 30V, the electric current of 60 to 200A and the Ar gas pressure of 10 to 90kPa; electricity is discharged under the pressure, and the products generated in the response are collected after discharging to obtain the copper nano-particles packed by nano-carbon. The application is that the copper nano-particles packed by nano-carbon are homogeneously dispersed in silicon oil as thermal conducting fillers. The metal nano-particles packed by nano-carbon have high-efficient heat dissipation function; the copper nano-particles packed by nano-carbon can make use of the function of metal nano-particles to realize high-efficient transferring of heat and can also improve the deformation capability of metal nano-particles; the copper nano-particles packed by nano-carbon has corrosion resistance property, insulating property, and can reduce weigh; besides, the copper nano-particles packed by nano-carbon can effectively solve the problem of thermocontact, thereby being capable of being used in the heat-dissipation encapsulations of various electronic products.

Description

technical field [0001] The invention relates to a preparation method of carbon-wrapped copper nanoparticles, and also relates to the application of carbon-wrapped copper nanoparticles as heat-conducting fillers. Background technique [0002] In the heat-conducting materials used in the packaging of electronic products, due to the poor thermal conductivity of high-molecular polymers used as insulating base materials, high-thermal-conductivity fillers are usually added. The key component of heat-conducting materials is fillers, whose function is to conduct heat. As heat-conducting fillers Should meet the following requirements: (1) high thermal conductivity. (2) Low coefficient of thermal expansion. (3) Low density. (4) High corrosion resistance. Many metals are good thermal conductors, but their poor corrosion resistance also limits their use in some occasions. It is required that the filler is not easy to be oxidized and deteriorated, thereby affecting its properties. (5)...

AI Technical Summary

Problems solved by technology

(2) Low coefficient of thermal expansion

(3) Low density

(4) High corrosion resistance. Many metals are good thermal conductors, but their poor corrosion resistance also limits their use in some occasions. It is required that the filler is not easy to be oxidized and deteriorated, thus affecting its properties.

There are no relevant reports on the research on carbon-coated copper nanoparticles thermally conductive fillers in China.