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Sheet adhering apparatus and sheet adhering method

A sheet sticking device and sheet technology, which are applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of unnecessary consumption of sheets, inability to use wafer sticking areas in recessed areas, uneven thickness, etc., and achieve the effect of eliminating unnecessary consumption.

Active Publication Date: 2008-11-26
LINTEC CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for an ultra-thin plate-shaped member that has been ground to a thickness of only tens of microns, such as a wafer, if a thin piece with traces of concave parts is used, the thickness will become uneven, or the wafer will be cracked during grinding. Therefore, the concave area cannot be used for the wafer bonding area
Therefore, although it is possible to exclude the concave region during sheet conveyance, the problem of unnecessary consumption of the sheet will be brought about in this way.

Method used

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  • Sheet adhering apparatus and sheet adhering method
  • Sheet adhering apparatus and sheet adhering method
  • Sheet adhering apparatus and sheet adhering method

Examples

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Embodiment Construction

[0035] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0036] FIG. 1 is a schematic front view of a sheet sticking device according to this embodiment, and FIG. 2 is a schematic perspective view thereof. In these figures, the sheet sticking device 10 is configured with the following parts: a sheet lead-out unit 12 arranged on the upper portion of the base 11; a table 13 supporting the wafer W as a plate-shaped member; The tab S imparts pressing force, and sticks the sticky sheet S to the squeeze roller 14 of the wafer W; Cutter 15; peeling device 16 for peeling unnecessary adhesive sheet S1 outside wafer W from the upper surface of table 13; and winding device 17 for winding unnecessary adhesive sheet S1.

[0037] The above-mentioned sheet lead-out unit 12 is constituted by comprising the following parts: a support roller 20 supporting a roll-shaped roll paper L, and a belt-shaped adhesive sheet S is temporarily attached t...

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Abstract

A sheet adhering apparatus (10) is provided with a sheet feeding unit (12) for feeding an adhesive sheet (S) to a position facing a plane of a semiconductor wafer (W), and a pressing roller (14) for adhering the adhesive sheet (S) on the wafer (W) by pressing the adhesive sheet (S). The sheet feeding unit (12) includes a tensile force measuring means (35) for measuring a tensile force of the adhesive sheet (S) between the sheet feeding unit (12) and the pressing roller (14) and an adhering angle maintaining means (37) having a feeding head (49) for maintaining an attaching angle (theta). After adjusting the tensile force by measuring the tensile force just before adhering the adhesive sheet (S), the feeding head (49) is brought down in proportion to a moving quantity of the pressing roller (14) to maintain the adhering angle (theta), and the tensile force is kept constant.

Description

technical field [0001] The present invention relates to a sheet sticking device and a sticking method. More specifically, the present invention relates to a device capable of sticking a sheet to a specified position of a plate-shaped component such as a semiconductor wafer with high precision. A sheet pasting device and a pasting method thereof. Background technique [0002] Conventionally, a protective sheet for protecting the circuit surface of the semiconductor wafer (hereinafter simply referred to as "wafer") is attached, or an adhesive sheet for die bonding is attached to the back surface thereof. [0003] As a method of pasting such a sheet, the following method of pasting is known: using a roll paper with a tape-shaped adhesive sheet temporarily attached to the tape-shaped release sheet, peeling the adhesive sheet from the above-mentioned release sheet, and pasting it on the wafer, Then, dicing is performed along the outer periphery of the wafer (for example, refer t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/67132H01L21/683
Inventor 野中英明小林贤治
Owner LINTEC CORP
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