Device and method for generating probe tester map data

Abstract

Provided is a device for generating map data of a probe tester and a method, comprising a data generating module, for generating original data of a wafer by using a wafer information file, wherein the file includes a plurality of characteristics of the wafer; an error detecting module, for detecting map error between a first coordinate of a chip and a second coordinate of the map chip in the original data corresponding to the chip on the wafer; a calibrating module, for computing correction, for compensating the map error between the first coordinate of the chip and the second coordinate of the map chip; and a coordinate correcting module, for correcting the coordinate of the map chip in the original data according to the correction. Therefore, no additional manual operation is required based on the original data related to the wafer to generate precise map data.

Description

technical field [0001] The invention relates to a device and a method for generating map data for a probe testing machine, in particular to a device and a method for automatically generating map data for a probe testing machine without manual operation. Background technique [0002] Generally, a semiconductor device is fabricated through a series of unit processes, such as a fabrication process, an electrical die sorting (EDS) process, and a packaging process. Before performing the packaging process, electrical characteristic detection of the circuit is performed on the wafer, and defective chips and non-defective chips are separated from each other through the EDS process. Known devices for the EDS process include a probe tester in which a plurality of probes contacts conductive pads of the wafer and detects defective chips on the wafer. [0003] The inspection accuracy of a probe tester is generally determined by the precise contact of the probes with the probe area of ​​...

AI Technical Summary

Problems solved by technology

[0008] However, the problem with the above-described process of generating map data is that the operator must rely on voluminous raw data printed separately on paper, and the corrected data is entered into the probe tester for each chip on the wafer, by It is very time-consuming to generate this map data

[0009] In addition, there is another problem in the above-mentioned map data generation process that it must depend on the operator's personal skill and precision, thereby reducing the accuracy of the calibration map data

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