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Conductive materials

A technology of conductive fillers and compositions, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, metal/alloy conductors, etc., can solve the problems of expensive coatings and adhesives, high cost, etc.

Inactive Publication Date: 2008-11-19
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

Such coatings and adhesives are often very expensive due to the high cost of the conductive metal, which is usually the most expensive component of the conductive composition, as opposed to the relatively low cost of the polymer

Method used

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  • Conductive materials
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0026] Three compositions were made according to the method of Example 1. Silver particles with an average particle size in the range of about 0.4 μm to about 1 μm are used, resulting in a polymer particle / nanosilver particle size ratio of about 1.5:1 to about 3.5:1. The ingredients of each composition are shown in Table 3.

[0027] The formula of table 3. compound 5-7

[0028] formula

[0029] 1 Silsphere 514, commercially available from Technic, Inc.

[0030] 2 Dur-O-Set C-325.

[0031] [022] According to the steps of Example 1, formulations 5-7 were coated, dried, heated and measured. Table 4 shows the annealing conditions, silver content, and resistivity of samples 5-7 after annealing.

[0032] After table 4. annealing, the characteristic of formula 5-7

[0033] formula

[0034] [024] Table 4 illustrates that when the silver particles are only slightly smaller than the polymer particles, the silver particles have a percolation threshold of at lea...

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Abstract

A material for producing a conductive composition comprising polymer particles, conductive particles, and a liquid medium. The material is in a liquid / dispersion form until it is cured at which time it forms an electrically conductive composition. The composition contains larger sized polymer particles along with smaller metal conductive filler particles such as nanoparticle-sized filler particles. The larger polymer particles create excluded volume in the material matrix and reduce the percolation threshold of the conductive filler particles to provide a conductive material with a reduced volume fraction of electrically conductive filler. The electrical conductivity of the material is further increased after heat treatment which causes the conductive filler particles to sinter together to form a highly conductive network.

Description

technical field [0001] [001] The present invention relates to conductive materials for use in electronic devices. The material includes polymer particles, conductive particles and a liquid medium that dissipates after curing to provide a conductive film. Background technique [0002] [002] Conductive materials are used in many different electronic applications. Such materials are usually polymer based and contain metallic conductive fillers such as silver powder or flakes. After application and curing, the conductive metal forms a percolated network in the polymer matrix, which provides conductive pathways. Typical electronic coatings and conductive adhesives require very high loadings of conductive fillers, where the conductive fillers typically constitute about 70-85 wt% of the composition due to the high percolation threshold. Such coatings and adhesives are often very expensive due to the high cost of the conductive metal, which is usually the most expensive component...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/20
CPCH01B1/22H01B1/02
Inventor 包荔蓉肖越魏斌
Owner HENKEL KGAA
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