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Backlight module frame and its assembling method

A backlight module and frame technology, which is applied in the field of backlight module frame and its assembly, can solve the problems of low reusability, high mold complexity, high mold opening cost and time, so as to reduce mold opening cost, increase heat dissipation area, and help The effect of heat dissipation

Inactive Publication Date: 2008-11-19
INNOLUX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the backlight module frame used in the previous technology is an integrally formed backlight module frame when making TFTLCD panels; when making the backlight module frame, it takes a lot of mold opening cost and time, and the backlight module of large-size LCD The backplane mold itself has the disadvantages of high mold complexity and low reusability

Method used

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  • Backlight module frame and its assembling method
  • Backlight module frame and its assembling method
  • Backlight module frame and its assembling method

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Embodiment Construction

[0021] The present invention modularizes the frame structure of the backlight module through the concept of modularization and adopts a single cross-section structure design. The board body part of the frame is assembled to form the required size, and around the board body, respectively The baffle and the side panels are installed to form the frame of the backlight module; the baffle is provided with a groove and a supporting plate, which can be used for arranging the optical film group.

[0022] The frame of the backlight module of the present invention can be applied to a direct-type backlight module (as shown in FIG. 1 ) or a side-type backlight module (as shown in FIG. 9 ). The present invention will be described below using an embodiment of an LED backlight module; firstly, an embodiment of a direct-type backlight module will be described, please refer to FIG. 1 , FIG. 1A-FIG. 1C, FIG. 2 , and FIG. 3 . As shown in the figure, the modularized backlight module of the presen...

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Abstract

The invention provides a backlight module framework and an assembly method; based on a single-section structure through a modularized concept, the framework structure of a backlight module is modularized and the board body part of the framework is formed upon a required size in an assembly manner; in addition, baffle plates and side plates are respectively arranged around the board body to form a backlight module framework; optical patch groups are respectively arranged on the grooves and the support plates on the baffle plates; compared with the prior art, the invention can improve the complexity and reutilization of the backboard die for large-size LCD backlight modules, reduce the die sinking cost and time of the backboard die for large-size LCD backlight modules, so as to achieve the purpose of reducing the cost of the backlight modules; besides, the invention also discloses the design of heat sinks to increase the heat radiation area and cooling the light source groups.

Description

field of invention [0001] The invention relates to a backlight module frame and an assembling method thereof, in particular to a backlight module frame and an assembling method thereof which reduce the mold-making cost and time of a large-size LCD. technical background [0002] Since the TFT LCD panel does not have the ability of self-illumination, the main function of the backlight module is to provide the light source required by the LCD panel. In today's digital video environment, there are a wide variety of digital products such as computer screens and TVs, and the market's demand for large-size TFT LCD panels is gradually increasing, making the niche market for large-scale LCD products more complete. [0003] At present, the development of TFT LCD panels is in the stable period of mass production technology, and low price and mass production will become the main development bottleneck of TFT LCD panels. Because the backlight module frame used in the previous technology...

Claims

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Application Information

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IPC IPC(8): G02F1/1333G02F1/13357G02F1/1335
Inventor 陈永坤
Owner INNOLUX CORP
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