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Tape coiling type packaging construction capable of inserting and electronic device using the construction

An electronic device and structural technology, which is applied in the direction of printed circuits, circuits, and electrical components connected with non-printed electrical components, to achieve the effects of easy replacement, modular heat dissipation, and low cost

Inactive Publication Date: 2011-03-16
CHIPMOS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] It can be seen that the above-mentioned existing tape and reel packaging structure obviously still has inconvenience and defects in structure and use, and further improvement is urgently needed
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

Method used

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  • Tape coiling type packaging construction capable of inserting and electronic device using the construction
  • Tape coiling type packaging construction capable of inserting and electronic device using the construction
  • Tape coiling type packaging construction capable of inserting and electronic device using the construction

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Embodiment Construction

[0071] In order to further explain the technical means and effects that the present invention adopts to achieve the intended purpose of the invention, the pluggable tape-and-reel packaging structure proposed according to the present invention and the electronic device using the structure will be described below in conjunction with the accompanying drawings and preferred embodiments. The specific implementation, structure, features and effects of the device are described in detail below.

[0072] In the first embodiment of the present invention, a pluggable tape and reel packaging structure is disclosed. figure 2 is a schematic cross-sectional view of the tape and reel package configuration, image 3 A schematic bottom perspective view of the tape and reel package configuration.

[0073] see figure 2 As shown, a pluggable tape and reel packaging structure 200 mainly includes a flexible circuit substrate 210 , a chip 220 and an encapsulant 230 . The flexible circuit substra...

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Abstract

The invention relates to a pluggable tape-type package structure and an electronic device using the configuration. The pluggable tape-type package configuration mainly comprises a flexible circuit substrate, a chip arranged on the substrate and a sealant formed between the substrate and the chip, wherein the chip includes a plurality of electrode terminals, which are inner terminals of pins electrically connected with the chip whereas the outer terminals of the pins are arranged on the edge of the same side of the substrate and electroplated to form a plurality of connecting fingers, thus functioning as being pluggable, extending the purpose of the tape-type package configuration and widening the range of packaged chip. The electronic device using the package configuration comprises a circuit carrier and at least one pluggable tape-type package configuration.

Description

technical field [0001] The invention relates to a tape and reel packaging structure, in particular to a pluggable tape and reel packaging structure and an electronic device using the structure. Background technique [0002] The existing conventional tape and reel packaging structure can be mainly divided into tape carrier package structure (TapeCarrier Package, TCP) and thin film flip chip packaging structure (Chip-On-Film package, COF). -to-reel) a flexible circuit substrate for semiconductor packaging operations. Generally speaking, the chip that can be packaged by the tape and reel packaging structure is a display driver chip, which has output and input terminals with a high number of pins, and is respectively arranged on two sides of the flexible circuit substrate. [0003] see figure 1 As shown, a tape and reel packaging structure 100 is a film flip-chip packaging type, which includes a flexible circuit substrate 110 , a chip 120 and an encapsulant 130 . The flexib...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498H05K1/02H05K1/18
CPCH01L2224/73204
Inventor 刘光华
Owner CHIPMOS TECH INC
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