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Micro-element dynamic performance off-chip tensile test experimental bench

A test experiment and external stretching technology, applied in the field of micro-component mechanical performance testing, can solve problems such as expensive equipment, unsatisfactory sample clamping methods, and influence on measurement results, etc., to achieve a simple and practical overall structure and convenient sample installation and adjustment , Realize the effect of high precision centering

Inactive Publication Date: 2008-07-09
DALIAN UNIV OF TECH
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AI Technical Summary

Problems solved by technology

[0003] At present, the mechanical properties of micro-components at home and abroad generally have the following characteristics: most of the structures are relatively complex, the required equipment is relatively expensive, and it is difficult to upgrade the experimental equipment smoothly; some methods can only measure For samples with relatively large sizes, the clamping method of the samples is not ideal; some methods use a conversion mechanism for displacement and force measurement, resulting in relatively large dispersion of measurement data; some test benches have too many mechanical structures, which introduces different Necessary friction, which affects measurement results, etc.

Method used

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  • Micro-element dynamic performance off-chip tensile test experimental bench

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Embodiment Construction

[0014] The specific implementation of the present invention will be described in detail below in conjunction with accompanying drawing 1 . First of all, the preparation of the tensile sample is carried out. The mechanical properties of the micro-components are placed on a shock-absorbing platform, and all the devices and devices of the experimental platform are covered with a closed protective frame made of plexiglass, and then the The temperature of the environment where the test bench is located is controlled at a constant temperature. Use MEMS processing technology to process tensile samples, calibrate the static characteristics of displacement sensors and force sensors, debug various instruments and equipment used in tensile experiments to make them work normally, and debug the control software of tensile experiments to enable them to work Quickly and accurately record the collected data.

[0015] When installing the sample, first adjust the five-dimensional micro-positio...

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Abstract

An off-chip tensile test experimental platform for micro-component mechanical property belongs to the field of micro-component mechanical property test in a micro-electro-mechanical system. The experimental platform comprises a piezoelectric drive unit, a micro-force detection unit, a displacement detection unit, a sample arranging and adjusting unit, an image monitoring and collecting unit and a pedestal. The piezoelectric drive unit consists of a package structure with a piezoelectric ceramic actuator arranged therein and a support. The micro-force detection unit consists of a force sensor and a force sensor support plate. The displacement detection unit is composed of a displacement sensor and a displacement sensor support. The sample arranging and adjusting unit consists of a five-dimensional micro-positioning stage, a movable stage and a static stage. The image monitoring and collecting unit consists of a CCD camera, a microscope and a microscope stand. The off-chip tensile test experimental platform for micro-component mechanical property overcomes the disadvantages of the prior tensile test experimental device, and has the advantages of low cost, simple structure, higher accuracy and smooth upgrade to satisfy the requirement of off-chip tensile test of micro-component mechanical property.

Description

technical field [0001] The invention discloses a micro-component mechanical property off-chip tensile testing test bench, which belongs to the field of micro-component mechanical property testing in the field of micro-electromechanical systems. Background technique [0002] The development of micro-component mechanical performance testing technology in micro-mechanical electronic systems lags far behind other technologies in the field of micro-mechanical electronic systems. Factors tend to be diverse and complex. These factors require higher detection accuracy of the micro-scale mechanical quantities. Conventional mechanical testing methods include uniaxial tensile method, micro-beam bending method, nano-indentation method and micro-beam vibration method. Because the uniaxial tensile method can directly test the stress-strain relationship of materials, it has the advantages of easy analysis and explanation of experimental data, strong versatility of experimental data, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/00
Inventor 褚金奎张段芹侯志武关乐王立鼎
Owner DALIAN UNIV OF TECH
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