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A kind of semiconductor glue and preparation method thereof

A technology of semiconductors and rubber materials, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of poor shielding reliability and safety, achieve good electrostatic shielding effects, wide application range, and reduce product costs Effect

Active Publication Date: 2011-11-30
XIAN XIDIAN TRANSFORMER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a semiconductor glue and its preparation method, which solves the technical problem of poor reliability and safety of shielding in the background art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1 example 2 example 3 example 4

[0053] Example 1 Example 2 Example 3 Example 4 Example 5 Example 6

[0054] Compound 55 65 57 62 58 63

[0055] Packing 41 31 40 35 40 33

[0056] Low temperature curing agent 4 4 3 3 2 4

[0057] Sizing material of the present invention, by weight percentage, specific embodiment is as follows:

example 1 example 2 example 3 example 4

[0059] Epoxy glue 79 81 80 79

[0060] Hardener 8 8 7 9

[0061] Toughener 13 11 13 12.

[0062] Filler of the present invention, by weight percentage, specific embodiment is as follows:

example 1 example 2 example 3 example 4

[0064] Graphite 61 58 62 59

[0065] Kaolin 39 42 38 41.

[0066] The epoxy glue of the semiconductor glue of the present invention is preferably E-44 epoxy resin, and E-42 epoxy resin or E-51 epoxy resin can also be used. The curing agent can be selected according to the epoxy glue and curing temperature. Specifically, a medium temperature curing agent or a normal temperature curing agent can be used, such as 594 curing agent, triethanolamine or dicyandiamide. The toughening agent is preferably liquid dibutyl phthalate. The low-temperature curing agent is better to use 651 low-molecular-weight polyamide curing agent. Graphite is preferably graphite with a purity content ≥ 98% and a particle size above 300 mesh. Kaolin can be used with a particle size of 300 mesh or more.

[0067] The embodiment of semiconductor glue preparation method of the present invention is as follows:

[0068] (a) Weigh each component by weight percentage: E-42 epoxy resin 480g, triethanolamine 42g...

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Abstract

The invention relates to a semiconductor glue used in electrical products, which contains 55-65% of glue, 79-81% of epoxy glue, 7-9% of curing agent, and 11-13% of toughening agent by weight percentage. %; filler 31-41%, including graphite 58-62%, kaolin 38-42%; low temperature curing agent 2-4%. Heat the epoxy glue into a fluid in an oven at 50-60°C; take the liquid epoxy glue in a beaker, and place it in a constant temperature water bath at 50-60°C; while stirring, add curing agent, toughening agent and thinner in sequence until stirring Evenly; add the filling and stir well. The invention solves the technical problem of poor reliability and safety of shielding in the background technology. The invention has simple process and high production efficiency, and can be used for electrostatic shielding or forming semiconductor layers.

Description

technical field [0001] The invention relates to a bonding glue and a preparation method thereof, in particular to a semiconductor glue used in electrical appliances and a preparation method thereof, and is especially suitable for electrostatic shielding of transformers, reactors, current transformers and the like. Background technique [0002] At present, the fastening, external binding and shielding of iron cores such as transformers, reactors, and current transformers are to bind non-weft tapes outside the iron core columns, and then wrap the electrostatic screen made of metal foil on the outside. The process is relatively complicated and the production efficiency is low. Due to the complex shielding structure and large volume, the inner diameter of the winding increases and more copper is consumed. Moreover, the metal foil is very thin and easy to break, and a potential suspension will be formed at the break, resulting in discharge. However, the fracture of the metal fo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/02C09J177/00
Inventor 李强陈敏懋
Owner XIAN XIDIAN TRANSFORMER
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