Ball grid array packaging substrate for enhancing spherical washer fixation and ball grid array packaging structure

Abstract

The invention relates to an encapsulation substrate with a spherical lattice array for enhancing the fixation of a spherical pad and an encapsulation structure with the spherical lattice thereof. The encapsulation substrate with a spherical lattice array for enhancing the fixation mainly includes a core layer of the substrate, a plurality of spherical pads and an anti-wielding layer. Every spherical pad has a metal pad and at least a metal nail. The metal pad is clingingly arranged on a surface of the core layer of the substrate and the metal nail is embedded in the core layer of the substrate. The anti-wielding layer is formed on the core layer of the substrate and the metal pad is exposed. The encapsulation structure with the spherical lattice includes the encapsulation substrate with a spherical lattice array and a plurality of solder balls and the plurality of solder balls are conjugated with the spherical pads. By utilizing the shapes of the spherical pads in the invention, contact area for the core layer of the substrate can be increased to further prevent a conjunction interface between the metal pad and the core layer of the substrate from separating or cracking.

Description

technical field [0001] The invention relates to a circuit substrate suitable for semiconductor packaging, in particular to a ball grid array packaging substrate and a ball grid array packaging structure that enhance the fixation of ball pads. Background technique [0002] see figure 1 Shown is a schematic cross-sectional view of a conventional BGA structure after surface bonding. An existing conventional ball grid array packaging structure uses a ball grid array packaging substrate 100 as a chip carrier. The ball grid array packaging substrate 100 mainly includes a substrate core layer 110, a plurality of ball pads 120 and a solder resist layer 130. . The substrate core layer 110 has a surface 111 . The ball pads 120 are disposed on the surface 111 of the substrate core layer 110 . The solder resist layer 130 is formed on the surface 111 of the substrate core layer 110 and exposes the ball pads 120 . The lines 140 are disposed on the surface 111 of the substrate core la...

AI Technical Summary

Problems solved by technology

However, this method will greatly increase the area occupied by the ball pads on the surface of the substrate, and cannot be applied to high-density ball grid array packaging substrates.

Also, this affects the wiring configuration of the BGA substrate

[0006] It can be seen that the above-mentioned existing ball grid array packaging substrate obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

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