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Production method of flexible circuit board

A flexible circuit board and manufacturing method technology, applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve problems such as tearing flexible circuit boards, and achieve the effect of convenient maintenance of molds

Inactive Publication Date: 2008-05-07
深圳市合力泰光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above deficiencies, the main purpose of the present invention is to provide a flexible circuit board manufacturing method that can effectively solve the problem of tearing at both ends of the boundary line formed between the reinforcing plate and the flexible circuit board.

Method used

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  • Production method of flexible circuit board
  • Production method of flexible circuit board
  • Production method of flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] Flexible circuit boards are generally formed by bonding and fixing a layer of copper foil on one side of the base film, and then bonding and fixing a layer of cover film on the top of the copper foil. This technology is an existing technology. Therefore, it will not be described in detail here.

[0016] The invention relates to a method for manufacturing a flexible circuit board, which relates to a method for manufacturing a flexible circuit with a reinforcing plate 3 on the back of the golden finger 2 of the flexible circuit board 1. Board 10 (please refer to FIG. 4, generally a small connecting board with a plurality of flexible circuit board products arranged according to a certain rule) forms a gold finger part 2 on one side of each flexible circuit board 1 correspondingly; The second step is the process of pasting the reinforcing plate, that is, attaching the reinforcing plate 3 on the other side of each flexible circuit board 1 opposite to the gold finger 2; the t...

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Abstract

The present invention discloses a manufacturing method for flexible line with a stiffening plate at the back of the golden finger of a flexible line board. The first step is that the golden finger part is formed on one surface of the corresponding flexible line board on a connecting plate. The second step is the working procedure of gluing stiffening plate, namely that the stiffening plate is glued on the other surface corresponding to the surface provided with the golden finger on each flexible line board. The third step is a stamping process for punching external form, namely that the working procedure of punching external form is carried on to each flexible line glued with stiffening plate on the connecting plate. In particular that after the first step is finished, a stamping process for punching opening is added, namely that an opening is punched correspondingly on the flexible line board at the two ends of the junction line of the height difference formed on the surfaces of the stiffening plate and the flexible line board, then the work of the second step is started. The manufacturing method can effectively solve the problem that the two ends of the junction line of the height difference formed between the stiffening plate on the flexible line board and the flexible line board are torn.

Description

technical field [0001] The invention relates to a method for manufacturing a flexible circuit board, in particular to a method for manufacturing a flexible circuit board with a reinforcing plate on the back of a golden finger of the flexible circuit board. Background technique [0002] At present, the flexible circuit board 1 used for plugging generally has a row of golden fingers 2 for plugging in with other electrical components. On the other side, add a thicker reinforcing plate 3 with respect to the product in order to improve the strength (see figure 1 ). When manufacturing flexible circuit board products for plugging, generally a number of flexible circuit board products with gold fingers are formed on a whole board, and then the reinforcement board 3 is fixed on the whole board, and finally the The entire piece is punched out, that is, the shape of the flexible circuit board product with the gold finger 2 is punched out together with the reinforcing plate 3 on the b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 赵冬梅
Owner 深圳市合力泰光电有限公司
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