Memory card structure

Abstract

A memory card structure consists of a circuit base plate and a casing enclosing the circuit base plate. At least one storage chip is arranged on a first surface of the side face of the circuit base plate, and an electrical contact part is arranged on a second surface opposite to the first surface. The casing enables the electrical contact part to be exposed though the casing encloses the circuit base plate. At least one metal heat conducting fin is arranged on the peripheral surface of the casing, and the metal heat conducting fin is in contact with the insulated surface of the storage chip of the circuit base plate. In this way, when the temperature of the memory card carrying out data access operation rises, the metal heat conducting fin in contact with the storage chip can transfer heat outwardly, thereby reaching the aim of heat radiation.

Description

technical field [0001] The present invention relates to the technical field of memory cards, in particular to a structure that enables the memory card to have a good heat dissipation effect. Background technique [0002] At present, various small memory cards, such as SD cards, MMC cards, etc., are small in size and very thin in order to facilitate portability and use in conjunction with electronic products, and the shape of such memory cards is currently a general standard specification. With the continuous increase of user demands, the demand for large-capacity memory cards is the current trend. How to increase the capacity of memory cards within a limited range is a subject for various manufacturers to study and think about. In addition to seeking ways to improve the packaging technology of the casing, A positive attitude is to continuously improve the memory chip technology, making the memory chip smaller and larger, and the capacity is getting bigger and bigger, so that...

AI Technical Summary

Problems solved by technology

However, the size of this type of memory card is only 32mm×24mm×2.1mm, and the interior is for the placement of circuit substrates and memory chips. With the increase in the capacity and number of memory chips, the temperature generated inside the operation process will significantly affect To the normal operation of the entire memory card, under the condition that the appearance of this type of memory card cannot be changed, to overcome the problem that the internal temperature may be too high, thereby prolonging the service life of the memory card, is the inventor's research and thinking. Issues in search of ways to improve

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