Semiconductor chip comb sliver repairing method and device

Abstract

A combed strip repair method and a device for a semiconductor chip are provided, which repair the abnormal combed strip by using a combed strip repair mechanism simulating the manual repair. The method simulating the manual repair is implemented by fixing a chip for semiconductor devices on a microscopic workbench by using a positioning device assembly, and repairing the chip combed strip by using a combed strip picking mechanism simulating the manual repair of chip combed strips, wherein the combed strip picking mechanism simulating the manual repair of chip combed strips can regulate the blade of the cutter for repairing combed strips to the root of the combed strip to be repaired and to align to the lengthwise direction of the combed strip by using a microdrive positioning mechanism, preparing for the pick of combined strips; and allow the blade to make linear movement by using a fastening / guide mechanism integrated with the cutter, completing the operation of picking combed strips. The combed strip repair mechanism comprises the chip positioning seat, the cutter, the microdrive positioning mechanism and the fastening / guide mechanism, and the whole mechanism is placed inside the microscopic workbench.

Description

technical field [0001] The invention relates to a semiconductor device processing method and device, in particular to a semiconductor device chip comb repair method and repair device. The technology of the invention is mainly used for high-power semiconductor thyristors with combs on the chip, and can also be used for repairing the combs of other semiconductor elements. Background technique [0002] There are combs on the surface of the chips of many semiconductor devices (such as GCT, GTO, etc.). These combs are important structures that constitute semiconductor devices. It is an important indicator of the normal operation of the product, so the processing requirements for the semiconductor chip sliver are very strict in the processing technology. However, due to various factors in the processing, it is inevitable that some sliver processing does not meet the requirements in the processing. Since the value of these semiconductor chips is very expensive, in order to prevent...

AI Technical Summary

Problems solved by technology

However, due to various factors in the processing, it is inevitable that some sliver processing does not meet the requirements in the processing. Since the value of these semiconductor chips is very expensive, in order to prevent this part of the semiconductor chip from being discarded, it is necessary to process the sliver. Further repairs to remove unqualified slivers and restore semiconductor chips to qualified requirements

At present, unqualified slivers in devices such as GCT / GTO are removed under a microscopic operating table and manually with a scalpel. The main disadvantage of this repair method is that it is difficult to operate and prone to operational errors, especially With the continuous expansion of the amount of semiconductor chip processing, this manual repair method can no longer meet the requirements of production capacity, so it needs to be improved

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