Non-fan chip heat radiator

Abstract

The present invention discloses a fan chip-free heat radiating device used in particular applicable to an industrial field with serious dust, pollution or vibration The present invention is characterized in that the present invention directly adopts a machine box with a metal fin as a heating radiating body, and takes a heat conducting rubber block corresponding to a chip that needs to radiate as a heat conductor, and is firmly connected with a heat conducting rubber hot end though a groove in the machine box, the cold end of the heat conducting rubber is closely touched with the chip that needs to radiate through a refrigeration chip, the heat radiation performed or the accurate temperature control performed to more chips is simultaneously realized, the polluted environment of the dust and the oil fume can be completely separated, simultaneously, a clamping and fixing function to the chip is provided. The heat radiating efficiency and the freedom from vibration of the present invention is better, the accurate temperature control can be performed, and the structure is simple, stable and reliable, the noise interference is free, the present invention can be widely applied to various electronic and electric equipments and products, in particular to an industrial field with serious dust, pollution or vibration and in particular to electronic and electric equipments and products of a quiet occasion.

Description

a technical field [0001] The invention relates to a chip heat dissipation device, in particular to a fanless chip heat dissipation device suitable for industrial sites with severe dust, pollution or vibration and occasions where quietness is particularly required. Two background technology [0002] Industrial production sites are often accompanied by serious dust, oil fume and other particulate matter pollution. Therefore, the computer that works quickly in this environment not only has to bear the influence of its own heat, but also suffers from the serious erosion of dust and soot. Solve the heat dissipation problem, and because the fan is a mechanical product with a limited lifespan and high noise, it will often cause shutdowns and fan noise troubles, coupled with unresolvable dust and oily smoke, not only the poor heat dissipation of the computer, but also frequent crashes , and even cause corrosion of circuits and components. Invention Patent No. 200510026459.X disclo...

AI Technical Summary

Problems solved by technology

Therefore, the computer that works quickly in this environment not only has to bear the influence of its own heat, but also suffers from the serious erosion of dust and soot. Solve the heat dissipation problem, and because the fan is a mechanical product with a limited lifespan and high noise, it will often cause shutdowns and fan noise troubles, coupled with unresolvable dust and oily smoke, not only the poor heat dissipation of the computer, but also frequent crashes , and even cause corrosion of circuits and components

Invention Patent No. 200510026459.X discloses a fanless cooling device, which mainly uses a semiconductor cooling chip and a heat dissipation metal sheet to cool down. Although the noise of the fan is avoided, the heat generated by the hot end of the cooling chip is quite large and is directly discharged to the The heat dissipation of other chips in the chassis is not good, and at the same time the whole device is relatively large, it can only dissipate heat for one CPU, and the main board is required to be a passive main board

Invention Patent No. 200510087127.2 discloses a fanless heat dissipation device, which further improves the heat dissipation effect of the computer by adopting the compression structure of the heat conductor, the heat sink with fins and the heat source assembly, and the pollution of dust and oil fume is published There is no description in the document, but according to the structural analysis of the cooling device, if the device needs to be covered with a casing, it can control dust and oily smoke to a certain extent, but heat dissipation will be affected. If the casing is not added, the dust cannot be solved. and oil fume pollution. In addition, the connection structure between the device and the chassis is relatively complicated, and the heat will be discharged to the inside of the chassis while dissipating heat, resulting in a poor working environment for the entire electronic device.

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