Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

P+PIN silicon photoelectric probe

A detector, silicon photoelectric technology, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of low response to short-wave light and small photogenerated current of PIN photodetectors

Inactive Publication Date: 2007-12-19
CHONGQING UNIV
View PDF0 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the incident light shines on the highly doped P + layer, due to the existence of a large number of interstitial atoms, dislocations and defects in the dead layer, the dead layer will greatly shorten the diffusion length of electron-hole pairs, and the high-concentration doped P + The electron-hole pairs generated by the layer are quickly recombined due to the short diffusion length, and only a few photo-generated electron-hole pairs can enter the depletion region, resulting in a small photo-generated current, resulting in a PIN photodetector Low responsivity to short wavelength light

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • P+PIN silicon photoelectric probe
  • P+PIN silicon photoelectric probe
  • P+PIN silicon photoelectric probe

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] Referring to Fig. 1, P of the present invention + PIN silicon photodetectors consist of lower N + Layer 2, non-doped intrinsic layer 3 in the middle, containing P in the upper part + The boron diffusion region of the type concentrated boron diffusion layer 5 . Among them, N + The lower surface of the layer 2 is provided with an N-type ohmic contact layer 1 for connecting the positive electrode of an external power supply, and the N-type ohmic contact layer 1 is formed by sputtering aluminum (Al). The upper end of the non-doped intrinsic layer 3 is provided with an insulating layer 7, and the insulating layer is provided with a + The P-type ohmic contact layer 6 in contact with the P-type concentrated boron diffusion layer 5 is used to connect the negative electrode of the external power supply, and the P-type ohmic contact layer is also formed by sputtering aluminum (Al). There is an incident light window 8 formed by photolithography on the insulating layer, so that...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention discloses a P+PIN silicon photoelectric detector including a N+ layer at the bottom, a non-doped intrinsic layer at the middle, a B diffusion area containing a P+type thick B diffusion layer at the top, in which, a N-type ohmic contact layer is set at the lower surface of the N+ layer, an insolation layer is set on the non-doped intrinsic layer, a P-type ohmic contact layer is set on the insulation layer contacted with the P+ type thick B diffusion layer, a window of incident light is formed on the insulation layer by etching, the B diffusion area is placed under the incident light window, the intrisic layer is placed between the N+ layer and the B diffusion region, which also includes a P type light B diffusion layer between the non-doped intrisic layer and the P+ type thick B diffusion layer thinner than the P type light B diffusion layer.

Description

technical field [0001] The invention relates to a photodetector device, in particular to a P + PIN silicon photodetector. Background technique [0002] Photodetection devices are used to convert optical signals into electrical signals, and such devices are widely used. Due to the characteristics of small size, low noise, fast response speed, and good spectral response performance, photodetectors have been developed rapidly in recent years and are widely used in optical reading of DVDs, CD-ROMs, etc., as well as in photoelectric detection systems and optical fiber communications. , and also widely used in the military. [0003] Early photodetectors were represented by PN photodetectors, but due to the narrow depletion region of PN photodetectors, the absorption efficiency of light is low, so there are disadvantages such as slow response speed, large dark current, and low photoelectric conversion efficiency. In order to overcome the shortcomings of the PN photodetector, a n...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/105
Inventor 潘银松孔谋夫林聚承张仁富
Owner CHONGQING UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products