Low transfer mould paper and its producing method

Abstract

The present invention relates to a low transfer release paper and its making method. It includes base paper and silica gel layer coated on the base paper, and it is characterized by that the composition of said silica gel layer is formed from (by wt%) 2-10% of organic silicon, 0.04-0.50% of catalyst and 89.5-97.96% of toluene, at normal temperature they are prepared into organic silicon coating material. Besides, said invention also provides the concrete steps of its making method.

Description

Technical field: [0001] The invention relates to a release paper, in particular to a low-transfer release paper and a manufacturing method thereof. Background technique: [0002] With the development of science and technology, new materials emerge in an endless stream, and the upgrading of products in various fields makes the release paper more and more widely used. Common products include band-aids, correction tapes, self-adhesive stickers and women's sanitary napkins. Release paper has been used in these products, however, in actual use, the silicon surface of the release paper is bonded with the adhesive to varying degrees, and when the release paper is peeled off, the silicon surface of the release paper Part of the silicon will be transferred to the glue and the amount of silicon transferred is large, the viscosity of the glue will be greatly reduced. The data shows that the residual adhesion rate is relatively low, and the residual adhesion rate has reached about 50% t...

AI Technical Summary

Problems solved by technology

[0002] With the development of science and technology, new materials emerge in an endless stream, and the upgrading of products in various fields makes the release paper more and more widely used. Common products include band-aids, correction tapes, self-adhesive stickers and women's sanitary napkins. Release paper has been used in these products, however, in actual use, the silicon surface of the release paper is bonded with the adhesive to varying degrees, and when the release paper is peeled off, the silicon surface of the release paper Part of the silicon will be transferred to the glue and the amount of silicon transferred is large, the viscosity of the glue will be greatly reduced. The data shows that the residual adhesion rate is relatively low, and the residual adhesion rate has reached about 50% to 60%, resulting in The main reason for this phenomenon is that the silicone used in the silicone layer of the existing release paper is condensation reaction silicon, and small molecular substances are generated during the reaction process, which affects the residual adhesion rate. The silicone coating clothed on the base paper needs to be heated at high temperature to fully react the silicon components before forming a silicon film with a certain structure and firmly adhering to the base paper. The temperature is high, the reaction speed is fast and sufficient, and It is conducive to improving the residual adhesion rate and uniform peeling force, while the traditional operation generally controls the drying temperature within 150°C, and the length of the oven is also short, and there is no perfect silicon curing condition, so that the drying process conditions are not good. In addition, rehumidification is to supplement the moisture lost by the base paper due to high-temperature drying, so that the paper is not brittle or curled. However, steam rehumidification is usually used, so that the amount and direction of steam are easily affected by external factors, causing instability. In this way, the uniformity of the amount of water on the paper is poor. At the same time, there is no foreign matter detection equipment in the online process, and small foreign matter and defects on the paper cannot be found and mixed into the product, which also causes product quality problems.