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SOI compound covariant layer underlay with the metal Hafnium middle layer

An intermediate layer and substrate technology, applied in electrical components, electrical solid-state devices, circuits, etc., to achieve the effect of facilitating realization, improving growth quality, and superior optoelectronic performance

Inactive Publication Date: 2007-08-15
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although there have been reports on the preparation of GaN materials grown with almost zero mismatch with hexagonal hafnium (α-Hf) bulk single crystal materials, it is possible to use these hexagonal refractory metal materials as intermediate layers to improve Si substrates. The research on large mismatch heterostructure materials ZnO, GaN and AlN prepared and grown on the substrate has not been reported yet.

Method used

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  • SOI compound covariant layer underlay with the metal Hafnium middle layer
  • SOI compound covariant layer underlay with the metal Hafnium middle layer
  • SOI compound covariant layer underlay with the metal Hafnium middle layer

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Embodiment

[0043] (1) A conventional SOI covariable substrate was selected for the preparation of an SOI type composite covariable layer substrate. Figure 1 is a schematic structural diagram of an SOI type composite covariable layer substrate. The main technical parameters are shown in Table 1.

[0044] Table 1: Main Technical Parameters of SOI Composite Covariable Layer Substrates

[0045] SOI

composite

covariant

layer substrate

SOI

Can

Association

Change

lining

end

bottom branch

Supporting substrate 1

Material

Silicon (Si)

Thickness (μm)

300-5

00

crystal quality

single crystal

intermediate solution

coupling layer 2

Material

Silicon oxide (SiOx)

Thickness (nm)

200-6

00

crystal quality

amorphous or polycrystalline

top covariant

Layer 3

Material

Silicon (Si)

Thickness (nm)

...

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Abstract

The SOI composite covariant substrate with metal-Hf thin intermediate layer comprises: from bottom to top, a common SOI variant substrate, including a supporting bottom Si (100) substrate, a decoupling SiO2 insulation layer on middle, and a top ultrathin Si monocrystal covariant layer for mismatch strain coordination; a hexahedral metal-Hf thin intermediate layer together with the Si monocrystal covariant layer forming a composite covariant layer; and a large-mismatch extension layer forming large lattice mismatch with the Si (100) substrate to form together with former two parts a large-mismatch heterostructure.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an SOI compound variable layer substrate with a thin hexagonal metal hafnium intermediate layer. Background technique [0002] In addition to the advantages of good quality, large size, easy processing, low price, mature technology and integration, silicon (Si) substrates also have good electrical and thermal conductivity. The application prospects of mismatched heterostructure materials are more promising. Especially for those important wide-bandgap compound semiconductor materials such as zinc oxide (ZnO), gallium nitride (GaN) and aluminum nitride (AlN) that are difficult to obtain with large size, high quality, and low-cost bulk single crystals, it is especially important for Si substrates. High hopes were placed at the end. However, due to the large lattice mismatch and thermal expansion coefficient difference between Si and these materials, and the directly exposed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12
Inventor 杨少延陈涌海李成明范海波王占国
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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