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Symmetrical straight beam structure condenser type micro-acceleration sensor and manufacturing method thereof

A technology of acceleration sensor and structural capacitance, which is applied in the direction of measuring acceleration, velocity/acceleration/shock measurement, instruments, etc., can solve the problems of not being able to significantly reduce the cross-axis sensitivity and large lateral sensitivity of the device, and achieve the reduction of cross-sensitivity and simplify the process , Improve the effect of thermal stability

Active Publication Date: 2009-10-21
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But usually the elastic beam of this structure is not in the same plane as the center of the sensitive mass block, which will cause a large lateral sensitivity, that is, the acceleration signal in the non-sensitive direction will also cause a large output, such as Kampen R.P.V., Wolffenbuttel R.F., Modeling the mechanical behavior of bulk-micromachined silicon ccelerometers, Sensors and Actuators, A64, 1998, 137-150. In order to reduce the lateral effect, the two silicon wafers were etched on one side of the quality block pattern and then silicon-silicon bonded. Erosion forms an intermediate mass with elastic beams on both sides, such as Henrion W.S., et.al, Sensors structure with L-shaped spring legs, US Patent No. 5,652,384, because its elastic beam is an L-shaped beam, the first order mode is Detection mode, the frequency of the second and third modes is about 3-4 times of the frequency of the first mode, which cannot significantly reduce the cross-axis sensitivity of the device

Method used

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  • Symmetrical straight beam structure condenser type micro-acceleration sensor and manufacturing method thereof
  • Symmetrical straight beam structure condenser type micro-acceleration sensor and manufacturing method thereof
  • Symmetrical straight beam structure condenser type micro-acceleration sensor and manufacturing method thereof

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Embodiment 1

[0044] Embodiment 1 of the present invention relates to a micro-acceleration sensor structure, combined with the attached figure 1 illustrate.

[0045] Such as figure 1 As shown in (a), one end of the straight elastic beam 1 is connected to the top corner of the central mass 2 through the short beam 4, and the other end is connected to the external support frame 3 perpendicular to it. Such as figure 1 As shown in (b), the micro-acceleration sensor structure includes a centrally symmetrical mass block 2, an external support frame 3, eight up and down symmetrical straight elastic beam structures 1 connected to the centrally symmetrical mass block 2 and the external support frame 3, and an upper Cover plate 27, lower cover plate 28. The mass block 2 is composed of the top mass block silicon chip 6 and the bottom mass block silicon chip 7, the straight elastic beam structure 1 is composed of the top elastic beam 22 and the bottom elastic beam 21, and the external support frame ...

Embodiment 2

[0057] Embodiment 2 of the present invention relates to another micro-acceleration sensor structure. The difference from Embodiment 1 is that the distribution of straight elastic beams and the positions of capacitance gaps are different. image 3 illustrate.

[0058] Such as image 3 As shown in (a), one end of the straight elastic beam 1 is connected to any position 5 of the central mass 2 along its side length except the top corner through the short beam 4, and the other end is connected to the external support frame 3 perpendicular to it. Such as image 3 As shown in (b), the micro-acceleration sensor structure includes a centrally symmetrical mass block 2, an external support frame 3, eight vertically symmetrical straight elastic beam structures 1 connected between the mass block 2 and the external support frame 3, and an upper cover plate 27 , Lower cover plate 28. The centrosymmetric mass block 2 is composed of the top mass block silicon chip 6 and the bottom mass blo...

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Abstract

The invention relates to a capacitive micro-acceleration sensor with a symmetrical straight beam structure and a manufacturing method thereof. It is characterized in that the acceleration sensor is composed of a centrally symmetrical mass block, an external support frame, eight vertically symmetrical straight elastic beam structures connected to the mass block and the external support frame, and upper and lower cover plates. One end of each straight elastic beam is connected to the top or bottom side of the mass block parallel to the elastic beam, and the other end is connected to the inner side of the external support frame perpendicular to the elastic beam. The capacitive acceleration sensor with a symmetrical straight beam structure provided by the invention can significantly reduce the lateral effect and improve sensitivity at the same time. It is manufactured by a micro-electro-mechanical system process and is a high-performance micro-mechanical acceleration sensor.

Description

technical field [0001] The invention relates to a capacitive micro-acceleration sensor with a symmetrical straight beam structure and a manufacturing method thereof, belonging to the field of micro-electromechanical systems. Background technique [0002] Acceleration sensors manufactured using micromechanical technology have the advantages of small size, light weight, low cost, high reliability, mass production, and easy integration with electronic circuits, and can be widely used in many fields such as aviation, aerospace, automobiles, robots, and oil exploration. , has a huge market application prospect. At present, the micromachined acceleration sensor has become the mainstream development direction. According to the sensitive principle, micro-mechanical acceleration sensors can be divided into capacitive, piezoresistive, piezoelectric, electromagnetic, thermal convection and resonant. Compared with the piezoresistive or piezoelectric type, the capacitive acceleration s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/125
Inventor 车录锋徐玮鹤熊斌戈肖鸿王跃林
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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