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Preparation method of biological microelectrode array based on flexible substrate

A micro-electrode array and flexible substrate technology, applied in the field of biomedical engineering, can solve the problems of unfavorable device biocompatibility, toxicity of corrosive liquid, etc., and achieve the effects of high yield, low impedance and simple process

Inactive Publication Date: 2009-10-21
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal or SiO 2 As a sacrificial layer, the corrosive solution used is toxic and is not conducive to the biocompatibility of the device

Method used

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  • Preparation method of biological microelectrode array based on flexible substrate
  • Preparation method of biological microelectrode array based on flexible substrate

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Experimental program
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Effect test

Embodiment 1

[0020] Structural parameters of biological microelectrode array: glass substrate, polydimethylsiloxane thickness 100 μm, polyimide thickness 50 μm, gold circuit height 2 μm, gold electrode height 5 μm.

[0021] (1) Preparation of flexible substrate

[0022] A glass sheet with a thickness of 2 mm was used as the substrate 1, and the substrate was firstly treated by ultrasonic cleaning with acetone, alcohol and deionized water, and dried in a vacuum oven at 180° C. for 3 hours. Then spin-coat polydimethylsiloxane 2 with a thickness of 100 μm on the substrate at a speed of 1000 rpm, and cure at 80° C. for 2 hours, then spin-coat polyimide acid with a thickness of 50 μm at a speed of 1000 rpm. The flexible base polyimide 3 is formed by thermal curing using a stepwise heating method (from 80° C. to 120° C. to 180° C. to 280° C.).

[0023] (2) Fabrication of metal metal circuits

[0024] First, sputter 50nm Cr / Cu metal base film 4 on the surface of flexible substrate polyimide 3, ...

Embodiment 2

[0030] Structural parameters of biological microelectrode array: glass substrate, polydimethylsiloxane thickness 300 μm, polyimide thickness 20 μm, gold circuit height 1 μm, gold electrode height 3 μm.

[0031] (1) Preparation of flexible substrate

[0032] A glass sheet with a thickness of 2 mm was used as the substrate 1, and the substrate was firstly treated by ultrasonic cleaning with acetone, alcohol and deionized water, and dried in a vacuum oven at 180° C. for 3 hours. Then spin-coat polydimethylsiloxane 2 with a thickness of 300 μm on the substrate at a speed of 700 rpm, and cure at 90° C. for 2 hours, then spin-coat polyimide acid with a thickness of 20 μm at a speed of 2000 rpm. The flexible base polyimide 3 is formed by thermal curing by a stepwise heating method (from 80° C. to 120° C. to 180° C. to 280° C.).

[0033] (2) Fabrication of metal circuits

[0034]First, sputter 100nm Cr / Cu metal base film 4 on the surface of flexible substrate polyimide 3, spin-coat ...

Embodiment 3

[0040] Structural parameters of biological microelectrode array: glass substrate, polydimethylsiloxane thickness 500 μm, polyimide thickness 100 μm, copper circuit height 10 μm, gold electrode height 1 μm.

[0041] (1) Preparation of flexible substrate

[0042] A glass sheet with a thickness of 2 mm was used as the substrate 1, and the substrate was firstly treated by ultrasonic cleaning with acetone, alcohol and deionized water, and dried in a vacuum oven at 180° C. for 3 hours. Then spin-coat polydimethylsiloxane 2 with a thickness of 500 μm on the substrate at a speed of 500 rpm, and cure at 90° C. for 3 hours, then spin-coat polyimide acid with a thickness of 100 μm at a speed of 500 rpm. The flexible base polyimide 3 is formed by thermal curing by a stepwise heating method (from 80° C. to 120° C. to 180° C. to 280° C.).

[0043] (2) Fabrication of metal circuits

[0044] First, sputter 150nm Cr / Cu metal base film 4 on the surface of flexible substrate polyimide 3, spin-...

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Abstract

The invention relates to a preparation method of a biological microelectrode array based on a flexible substrate, which adopts secondary photolithography and electroforming technology, and sequentially coats polydimethylsiloxane sacrificial layer and polyimide acid on the substrate surface, Thermal curing forms a polyimide flexible substrate, and prepares metal circuits on the flexible substrate by sputtering, photolithography and electroforming processes, then etches the metal base film, coats polyimide acid, photolithography and etch polyimide Imino acid, electroformed metal electrodes, thermally cured to form polyimide, and the prepared biomicroelectrode array based on polyimide flexible substrate was peeled off from polydimethylsiloxane. The electrodes are located at both ends of the metal circuit, and the electrode array is arranged according to the application requirements. One end of the electrode is connected to the biological tissue, and the other end is connected to the stimulator or measuring instrument. The metal circuit at the bottom of the electrode connects the electrodes on both sides. The biological microelectrode array manufactured by the invention has the advantages of high yield, controllable electrode position, small impedance, biocompatibility and the like.

Description

technical field [0001] The invention relates to a method for preparing a biological microelectrode array based on a flexible substrate. The prepared biological microelectrode array is used for artificial retina, brain stimulation and measurement electrodes, etc., and belongs to the field of biomedical engineering. Background technique [0002] Implantable bioelectrodes are mainly used for brain stimulation and brain current measurement. They can be used in the treatment of epilepsy or Parkinson's disease, and can also be used in cochlear implants or artificial retinas, so that the blind can see images and the deaf can hear sounds. The development of bioelectrode preparation technology will greatly improve and enhance people's living standards. Bioelectrodes require flexibility, biocompatibility, and low impedance, and the electrodes can be arranged according to needs. A. Hung introduced a flexible substrate biological microelectrode array preparation method in Microtechnolo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61N1/05A61F11/00A61B5/04B81B7/04B81C1/00
Inventor 陈迪刘舒维黄闯陈翔刘景全朱军
Owner SHANGHAI JIAO TONG UNIV
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