Hollow heat-insulation building block and method of producing the same

Abstract

The invention discloses a novel hollow insulating block and a preparation method thereof. The hollow thermal insulation block of the invention is mainly made of the following raw materials in parts by weight: 0.5-1.5 parts of acidified magnesium thermal insulation material additive and 1-3 parts of expanded perlite. The preparation method of the hollow thermal insulation block of the present invention comprises the following steps: 1) weighing each raw material according to the following parts by weight: 0.5-1.5 parts of acidified magnesium thermal insulation material additive and 1-3 parts of expanded perlite; 2) mixing the above raw materials evenly Finally, add water which is 30-40% of the total weight of the mixture, use the traditional brick-making process to press and make a hollow block, and dry it without calcination. The hollow thermal insulation block prepared by the method of the present invention is a non-burning product. After the slurry is dried, a crystal lattice is formed, and the minimum pressure can withstand 1.0MPa, and the maximum pressure can be as high as 2.0MPa, and its thermal conductivity is 0.08 -0.1 / m·k, which is 8 times the temperature resistance capacity of ordinary bricks. The thermal insulation brick of the invention has the advantages of energy saving, sound resistance, thermal insulation, fire prevention and pressure bearing, and is a building thermal insulation material with excellent performance.

Description

technical field [0001] The invention relates to a building material, in particular to a hollow thermal insulation block for building and a preparation method thereof, belonging to the field of building materials. Background technique [0002] At present, the thermal insulation materials using polystyrene board, dense polystyrene board and thermal insulation mortar (cement mixed with polystyrene particles) in the thermal insulation market all have their own insurmountable defects and unsatisfactory parts in technology. [0003] Polystyrene board is an organic material extracted from petroleum. Sensitive to the influence of temperature, the molecular activity is very active. The heat-resistant temperature is only 70°C, and the dimensional change rate reaches 5% after 48 hours at 70°C as measured by experiments. The outdoor temperature in Northeast China is -45°C to -20°C in winter, and the wall temperature in South China can reach a maximum of 70°C to 75°C in summer. The po...

AI Technical Summary

Problems solved by technology

Facing the specific implementation of this requirement and standard, the current thermal insulation exterior wall system, polystyrene board and compact board will face practical problems in technology and construction: the thermal conductivity of polystyrene board is 0.04w / m·k, The thermal conductivity of the dense board is 0.027-0.029w / m·k. Although the thermal conductivity of the dense board is good, its wind resistance value cannot withstand the high-rise buildings.

This will inevitably lead to the disadvantages of cumbersome construction, insufficient wind pressure resistance, and unsafe use on high-rise buildings.

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