Method for forming solder pad of semiconductor device

A semiconductor and device technology, applied in the field of semiconductor device pad formation, can solve the problems of long processing time of organic solvents and limiting production capacity, and achieve the effects of preventing electrochemical corrosion, improving production capacity, and reducing processing time

Inactive Publication Date: 2009-03-11
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Abstract
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Problems solved by technology

[0007] Using the above method, although the lattice defects on the surface of the pad are removed during the process of forming the pad, the required organic solvent treatment time is too long, which limits the increase in production capacity. Therefore, how to apply it in the process of pad formation The organic solvent removal method removes the lattice defects on the pad surface while reducing the processing time has become the main problem faced by those skilled in the art at this stage

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  • Method for forming solder pad of semiconductor device
  • Method for forming solder pad of semiconductor device
  • Method for forming solder pad of semiconductor device

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Embodiment Construction

[0028] Although the present invention will be described in more detail below with reference to the accompanying drawings, in which preferred embodiments of the invention are shown, it should be understood that those skilled in the art can modify the invention described herein and still achieve the advantageous effects of the invention. Therefore, the following description should be construed as a broad teaching for those skilled in the art, rather than as a limitation of the present invention.

[0029] In the interest of clarity, not all features of an actual embodiment are described. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be recognized that in the development of any actual embodiment, a number of implementation details must be made to achieve the developer's specific goals, such as changing from one embodiment to another in accordance with system-...

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Abstract

A bonding pad forming method for semiconductor device comprises that: a current conducting layer is formed on a substrate of a semiconductor device; a bonding pad graph is etched on the current conducting layer; lattice defect detection is executed to the surface of the current conducting layer; diluted sulfur peroxide is utilized to process the lattice defects of the current conducting layer surface to form a bonding pad. The use of diluted sulfur peroxide which is a water-containing solution can remove the lattice defects of the bonding pad surface and simultaneously reduce the processing time of organic solvents, so as to improve productivity.

Description

technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, in particular to a method for forming a pad of a semiconductor device. Background technique [0002] The pad is used as a connecting component to form a connection between a semiconductor device and other semiconductor devices or electronic components to form an electronic circuit module. It is required to have good conductivity and high reliability, and plays an important role in the internal structure of the semiconductor device. Manufacturing process optimization has always been the goal pursued by device structure engineers. [0003] figure 1 In order to illustrate a schematic diagram of a method for forming a surface pad of a semiconductor device in the prior art, such as figure 1 As shown, in actual production, a general process for forming a pad of a semiconductor device includes: forming a conductive layer on the device substrate; coating a photoresist layer ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L21/28H01L21/66H01L21/321
Inventor 宋铭峰裴昌炜张水友
Owner SEMICON MFG INT (SHANGHAI) CORP
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