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Device for cooling an electrical component and production method thereof

A self-generated technology for electrical components, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as poor thermal conductivity

Inactive Publication Date: 2009-02-04
瓦莱奥电子联络系统公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Also, the middle block may be less thermally conductive than either of the two materials to which it is thermally connected

Method used

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  • Device for cooling an electrical component and production method thereof

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Embodiment Construction

[0027] The light-emitting diode 1 includes a heat source, namely a semiconductor 2 . The light-emitting diodes 1 are to be cooled by means of a cooling device designated according to the invention with the reference symbol D. FIG.

[0028] The light-emitting diode 1 is provided with a conductive terminal 4 to connect it to two completely parallel conductive strips 3, so as to provide the light-emitting diode 1 with necessary electric energy for operation. The conductive lug 4 also mechanically fixes the LED 1 to the conductive strip 3 .

[0029] The semiconductor 2 is supported by a heat dissipation metal block 5 . The heat sink 5 has a surface 5A through which heat is preferably removed.

[0030] The device D comprises a metal plate forming a heat sink 7 having a large surface 7A relative to the surface 5A. The heat sink 7 comprises two opposite small surfaces which are connected to the busbar 3 by overmolding material 8 , preferably plastic, so that the heat sink 7 can be...

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PUM

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Abstract

The present invention relates to a device for cooling exothermic electrical components and a method for its production. The inventive device consists of a metal part (7) forming a heat sink, which is thermally connected to a metal block of an electrical component forming a heat sink (5). According to the present invention, the radiator (7) is thermally connected to the heat dissipation block (5) by at least one heat dissipation pipe (10). The heat dissipation pipe is on a surface of the heat dissipation block (5) (called the heat dissipation surface 5A). It is formed by autogenous welding between the heat sink (7) and a surface (7A) of the heat sink (7) relative to the surface. The present invention can be used in devices for cooling electronic components, such as power electronic components.

Description

technical field [0001] The invention relates to a device for cooling an exothermic electrical component and a method for its production [0002] The invention finds particular application in devices for cooling electronic components, such as power electronics assemblies. Background technique [0003] The prior art has described devices for cooling heat-dissipating electrical components comprising a metal part constituting a heat sink thermally connected to a metal block of the electrical component forming a heat sink for the electrical component piece. [0004] Traditionally, the heat sink is thermally connected to the heat sink by means of an intermediate block, which is of a material different from that of the heat sink as well as from that of the heat sink. Typically the supplied material is a binder (polymer) or solder. [0005] The supplied material is typically melted or polymerized. [0006] In fact, some electrical components may have parts that are not compatibl...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L23/36H01L33/64
CPCH01L2933/0075H01L23/36H01L33/64H01L2924/0002H01L2924/00
Inventor J·-M·莫雷勒L·维夫特
Owner 瓦莱奥电子联络系统公司
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