Method for mfg. plasma display
A technology of plasma and manufacturing method, applied in the manufacture of discharge tube/lamp, cold cathode manufacture, tube/lamp screen manufacture, etc., can solve the problems of poor crimping effect, uneven heating, broken glass substrate, etc. Achieve the effect of improving crimping efficiency and success rate, high bonding strength, and preventing damage
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Embodiment 1
[0015] First, the anisotropic conductive film ACF film is pasted on the printed electrode of the glass substrate; then, the glass substrate with the anisotropic conductive film ACF film is placed on a crimping machine for low-temperature pre-pressing, and the glass substrate is heated up and down at the same time. The temperature is 100℃, the pressure is 5Kg / cm 2 ; Secondly, peel off the upper layer of the anisotropic conductive film ACF film, and retain the adhesive layer of the anisotropic conductive film ACF film; paste the flexible circuit board film FPC film on the printed electrode of the glass substrate with the anisotropic conductive film ACF film, and then apply The glass substrate is heated up and down at the same time, the temperature is 80℃, and the pressure is 4~6Kg / cm 2 ; When the plasma glass substrate is heated, a rubber elastic soft gasket is placed on the heated glass substrate. Put the place where the FPC film of the flexible circuit board is attached to th...
Embodiment 2
[0018] First, the anisotropic conductive film ACF film is pasted on the printed electrode of the glass substrate; then, the glass substrate with the anisotropic conductive film ACF film is placed on a crimping machine for low-temperature pre-pressing, and the glass substrate is heated up and down at the same time. The temperature is 80℃, pressure is 6Kg / cm 2 ; Secondly, peel off the upper layer of the anisotropic conductive film ACF film, and retain the adhesive layer of the anisotropic conductive film ACF film; paste the flexible circuit board film FPC film on the printed electrode of the glass substrate with the anisotropic conductive film ACF film, and then apply The glass substrate is heated up and down at the same time, the temperature is 100℃, and the pressure is 4~6Kg / cm 2 ; When the plasma glass substrate is heated, a rubber elastic soft gasket is placed on the heated glass substrate. Put the place where the FPC film of the flexible circuit board is attached to the cr...
Embodiment 3
[0020] First, the anisotropic conductive film ACF film is pasted on the printed electrode of the glass substrate; then, the glass substrate with the anisotropic conductive film ACF film is placed on a crimping machine for low-temperature pre-pressing, and the glass substrate is heated up and down at the same time. The temperature is 110℃, pressure is 4Kg / cm 2 ; Secondly, peel off the upper layer of the anisotropic conductive film ACF film, and retain the adhesive layer of the anisotropic conductive film ACF film; paste the flexible circuit board film FPC film on the printed electrode of the glass substrate with the anisotropic conductive film ACF film, and then apply The glass substrate is heated up and down at the same time, the temperature is 110℃, and the pressure is 4~6Kg / cm 2 ; When heating the plasma glass substrate, a plastic elastic soft pad is placed on the heated glass substrate. Put the place where the FPC film of the flexible circuit board is attached to the crimp...
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