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Copper-silver alloy conductor size and its preparing method

A copper-silver alloy, conductor paste technology, applied in the fields of nanotechnology and microelectronics, can solve the problems of instability, conductivity easily affected by the environment, etc.

Inactive Publication Date: 2008-10-29
SHENYANG POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The conductivity of copper powder paste is good and the price is cheap, but its conductivity is easily affected by the environment and is not very stable

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] The copper-silver alloy raw material with a silver content of 5.5Wt% is used as an anode, metal tungsten is used as a cathode, and a silver content of 5Wt% is prepared by a DC arc plasma method under a mixed atmosphere of hydrogen and argon with a hydrogen ratio of 45%. The copper-silver alloy nanoparticles have an average particle diameter of 86 nanometers. Weigh respectively 40Wt% of copper-silver alloy nanoparticles, 42Wt% of terpineol, 15Wt% of glass powder, 1Wt% of ethyl cellulose and 2Wt% of absolute ethanol according to mass percentage. First, mix terpineol, ethyl cellulose, and absolute ethanol thoroughly, then add copper-silver alloy nanoparticles, stir thoroughly, and use ultrasonic vibration for 20 minutes, then add glass powder, stir again, and then use ultrasonic vibration for 20 minutes A conductive paste is obtained.

[0013] Sintering slurry: use 300-mesh stainless steel screen printing to form a film, after fully drying, heat to 70°C under 1.33Pa vacuu...

Embodiment 2

[0016] The copper-silver alloy raw material with a silver content of 8Wt% is used as an anode, metal tungsten is used as a cathode, and a silver content of 8.5Wt% is prepared by a DC arc plasma method under a mixed atmosphere of hydrogen and argon with a hydrogen ratio of 45%. The copper-silver alloy nanoparticles have an average particle diameter of 90 nanometers. Weigh respectively 45Wt% of copper-silver alloy nanoparticles, 45Wt% of terpineol, 10Wt% of glass powder, 1.5Wt% of ethyl cellulose and 3.5Wt% of dehydrated alcohol according to mass percentage. First, mix terpineol, ethyl cellulose, and absolute ethanol thoroughly, then add copper-silver alloy nanoparticles, stir thoroughly, and use ultrasonic vibration for 20 minutes, then add glass powder, stir again, and then use ultrasonic vibration for 15 minutes A conductive paste is obtained.

[0017] Sintering slurry: use 300-mesh stainless steel screen printing to form a film, after fully drying, heat to 120°C under 1.33P...

Embodiment 3

[0020] The copper-silver alloy raw material with a silver content of 18Wt% is used as an anode, and metal tungsten is used as a cathode. Under a mixed atmosphere of hydrogen and argon with a hydrogen ratio of 45%, the copper-silver alloy with a silver content of 19Wt% is prepared by a DC arc plasma method. The copper-silver alloy nanoparticles have an average particle diameter of 98 nanometers. Weigh respectively 50Wt% of copper-silver alloy nanoparticles, 35Wt% of terpineol, 10Wt% of glass powder, 2.5Wt% of ethyl cellulose and 2.5Wt% of absolute ethanol according to mass percentage. First, mix terpineol, ethyl cellulose, and absolute ethanol thoroughly, then add copper-silver alloy nanoparticles, stir thoroughly and then oscillate with ultrasonic waves for 15 minutes, then add glass powder, stir fully again, and oscillate with ultrasonic waves for 20 minutes A conductive paste is obtained.

[0021] Sintering paste: use 300-mesh stainless steel screen printing to form a film,...

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Abstract

This invention provides Cu-Ag alloy conductor slurry and its manufacturing method including: preparing nm particles of Cu-Ag alloy, matching conductor slurry and sintering the slurry, in which, the nm particles are prepared under the mixed atmosphere of H and Ar with the DC arc plasma method and the preparation for the slurry includes: fully mixing terpinyl, EC and absolute alcohol then adding nm particles and fully beating them up to be vibrated by supersonic waves then to be added with glass power to beat them up again and vibrate them with supersonic waves to get the conductor slurry. The sinter temperature is bellow 220deg.C under 1.33Pa. Advantage: the sinter temperature is low not needing protection gas while sintering, the conductive stability is higher than Cu power slurry and it's possible to replace Au, Ag and Pd slurry.

Description

Technical field: [0001] The invention relates to the fields of nanotechnology and microelectronics, in particular to a thick-film conductor paste with copper-silver alloy nanoparticles as the main raw material and a preparation method thereof. Background technique: [0002] Conductive paste is widely used in the electronics industry, and the commonly used conductive materials in the conductive paste include gold, silver, palladium, nickel, copper and other metal powders and carbon powders. Gold, silver, and palladium conductor pastes have good conductivity, but are expensive, especially silver pastes are prone to ion migration in an external electric field, which affects insulation. The price of carbon powder paste is cheap, but the conductivity is poorer than other materials. Printed circuit boards that require high conductivity of nickel powder paste. The conductivity of copper powder paste is good and the price is cheap, but its conductivity is easily affected by the en...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/02H01B13/00C09D5/22C22C1/00B82B3/00
Inventor 孙维民李志杰史桂梅
Owner SHENYANG POLYTECHNIC UNIV
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