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LED module with high-efficient radiation

A light-emitting diode, high-efficiency technology, applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of related circuits not working properly

Inactive Publication Date: 2008-04-02
高陆股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even so, when light-emitting diodes are used as pixel display units of displays or lamps and lanterns, because a large number of light-emitting diodes are used at the same time, and multiple light-emitting diodes are lit at the same time, in this case, the multiple light-emitting diodes that are collectively lit Diodes will still generate more waste heat. Although the heat energy is not as high as that of tungsten filament bulbs, if it cannot be effectively dissipated, it may still cause related circuits to fail to work normally. It can be seen that even light-emitting diodes, which are known for their low heat energy, have The waste heat generated during group work still cannot be ignored

Method used

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  • LED module with high-efficient radiation

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Embodiment Construction

[0028] The specific implementation manner of the present invention will be described in detail below in conjunction with the accompanying drawings and examples.

[0029] A preferred embodiment of the present invention is shown in FIG. 1, the efficient heat dissipation LED module 10 includes:

[0030] A circuit layer 100, forming a specific circuit layout on the high thermal conductivity material;

[0031] A plurality of light-emitting diodes 20 are formed on the aforementioned circuit layer after the steps of chip loading, wire bonding, and glue sealing, and are connected to each other through the circuit of the circuit layer 100;

[0032] A heat sink 30 is in direct contact with the insulating oxide layer at the bottom of the circuit layer 100 , or bonded to the bottom surface of the circuit layer 100 through a thermally conductive adhesive 31 to provide a larger heat dissipation area.

[0033] Can find out the basic composition of a preferred embodiment of the present inven...

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Abstract

A light emitting diode module having high efficiency of heat emission, main point is: through chip packaging, wire bounding, mold etc steps the several light emitting diode are produced, the bottom of circuit layer is connected with a heat sink directly or through thermal conductive adhesive, when the light emitting diode works its heat energy can conduct fast to the heat sink through thermal conductive adhesive, so can use its large heat emission area to produce high efficiency of heat emission performance.

Description

technical field [0001] The invention relates to a high-efficiency heat dissipation light-emitting diode module, in particular to a modular light-emitting unit that can produce high-efficiency heat dissipation when light-emitting diodes are collectively lit. Background technique [0002] As known to those who are familiar with the characteristics of electronic components, light-emitting diodes have the advantages of long working life, low power consumption, and low heat energy. Today, blue light and white light-emitting diodes have come out one after another, and their brightness has also increased significantly. Therefore, today's light-emitting diodes are not only widely used in various display purposes, but have even successfully entered the field of lighting. Therefore, the development of light-emitting diodes in people's livelihood applications will have unlimited prospects. Even so, when light-emitting diodes are used as pixel display units of displays or lamps and lan...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L23/34H01L25/075
CPCH01L2224/48091H01L2224/45124H01L2224/45144H01L2924/00011H01L2924/00014H01L2924/00H01L2924/01005H01L2924/01004
Inventor 林定皓郭礼维
Owner 高陆股份有限公司
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